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Method and apparatus for monitoring and enhancing on-chip microprocessor reliability

  • US 7,454,316 B2
  • Filed: 10/08/2004
  • Issued: 11/18/2008
  • Est. Priority Date: 10/08/2004
  • Status: Active Grant
First Claim
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1. A method for monitoring a module, which includes one of a chip, integrated circuit printed wiring board and software module, based upon projected reliability, comprising the steps of:

  • dividing a module into regions;

    determining a module-wide reliability projection by performing reliability evaluations for module operations based upon measured operating physical characteristics of the module while the module is operating, the reliability projection including a measure of the reliability of the module based on current operating conditions of the module;

    determining a reliability projection in each region;

    comparing the reliability projection to a threshold to determine if an action is needed; and

    in accordance with the comparing step, adjusting operating conditions of the module to modify the reliability projection as feedback for continuing operations in accordance with the threshold.

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