Method and apparatus for temperature sensing in integrated circuits

• US 7,455,450 B2
• Filed: 10/07/2005
• Issued: 11/25/2008
• Est. Priority Date: 10/07/2005
• Status: Expired due to Fees

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Hewitt, Larry D., Liu, Huining
• Primary Examiner(s): Verbitsky; Gail
• Assistant Examiner(s): Vaughn; Megann E
• Application Number:
  US11/246,855
• Publication Number:
  US 20070081575A1
• Time in Patent Office: 1,145 Days
• Field of Search: 374/111, 331/57
• US Class Current: 374/111
• CPC Class Codes: G01K 7/203 in an oscillator circuit

Abstract

A method and apparatus for temperature sensing in an IC. The IC includes a plurality of remote temperature sensors each coupled to a control logic unit. The plurality of remote temperature sensors may be distributed throughout the integrated circuit. The integrated circuit includes a reference unit coupled to provide a reference temperature to the control logic unit and a reference sensor coupled to provide a signal having a reference frequency to the control logic unit. The reference unit and the reference sensor are located near each other. The control logic unit is configured to correlate the reference frequency received from the reference sensor with the reference temperature received from the reference unit. The control logic unit is further configured to determine the temperature of each of the remote temperature sensors based on this correlation, and also configured to determine the maximum temperature of all of the temperature sensors.

Claims

1. An integrated circuit comprising:

a plurality of remote temperature sensors;

a reference sensor wherein the reference sensor and each of the plurality of remote temperature sensors include a ring oscillator;

a reference unit configured to provide a reference temperature, wherein the reference sensor is located near the reference unit; and

a control logic unit operatively coupled to each of the plurality of remote temperature sensors and the reference unit, wherein the control logic is configured to determine a temperature of each the plurality of temperature sensors based on the reference temperature and a signal provided by the reference sensor and further configured to determine a maximum temperature of the plurality of remote temperature sensors and the reference sensor;

wherein the integrated circuit is a processor having a processor core and a bridge unit, wherein each of the plurality of remote temperature sensors are located in the processor core, and wherein the reference sensor, reference unit, and the control logic unit are located in the bridge unit; and

wherein the ring oscillator of the reference sensor and each of the plurality of remote temperature sensors are configured to provide an output signal within a range of frequencies, wherein a maximum frequency in the range of frequencies is at least one order of magnitude less than a clock frequency at which the processor core operates.

2. The integrated circuit as recited in claim 1, wherein the control logic unit is coupled to receive the reference temperature from the reference unit and the signal provided by the reference sensor, the signal provided by the reference sensor having a reference frequency, and wherein the control logic is configured to correlate the reference temperature to the reference frequency.

3. The integrated circuit as recited in claim 2, wherein the control logic unit is configured to receive an output signal from each of the plurality of remote temperature sensors, wherein the control logic unit is configured to determine a frequency for each output signal and further configured to determine a temperature for each remote temperature sensor based on the frequency of its respective output signal.

4. The integrated circuit as recited in claim 3, wherein the control logic unit is coupled to receive a reference clock signal, and wherein the control logic unit is configured to determine the reference frequency by determining a number of cycles of the reference signal occurring within a predetermined number of cycles of the reference clock signal and further configured to determine the frequency for each output signal by determining a number of cycles of each output signal occurring during the predetermined number of cycles of the reference clock signal.

5. The integrated circuit as recited in claim 4, wherein the control logic unit is further configured to determine the temperature of each of the plurality of remote temperature sensor based on a temperature equation.

6. The integrated circuit as recited in claim 3, wherein each ring oscillator includes an odd number of inverters and a resistor coupled to the output of each of the odd number of inverters.

7. The integrated circuit as recited in claim 1, wherein the control logic unit is in a first voltage domain and wherein the reference sensor and each of the plurality of remote sensors are in a second voltage domain.

8. The integrated circuit as recited in claim 7, wherein the integrated circuit further includes a level shifter coupled between each of the plurality of remote temperature sensors and the control logic unit.

9. The integrated circuit as recited in claim 7 wherein the integrated circuit includes a level shifter coupled between the reference sensor and the control logic unit.

10. A method comprising for monitoring a temperature of a processor, the method comprising:

providing a reference temperature and a signal having a reference frequency to a control logic unit;

providing an output signal from each of a plurality of remote temperature sensors to the control logic unit;

determining a correlation between temperature and frequency based on the reference temperature and the reference frequency;

determining a temperature for each of the plurality of remote temperature sensors based on a frequency of the output signal for each of the plurality of remote temperature sensors and the correlation between temperature and frequency; and

determining a maximum temperature for the plurality of remote temperature sensors and the reference sensor;

wherein the reference frequency and the frequency of the output signal for each of the plurality of remote temperature sensors is within a range of frequencies, and wherein a maximum frequency in the range of frequencies is at least one order of magnitude less than a clock frequency at which a core of the processor operates.

11. The method as recited in claim 10, wherein the reference sensor and each of the plurality of remote temperature sensors includes a ring oscillator, and wherein the control logic unit is configured to determine a frequency for the output signal produced by each of the plurality of remote temperature sensors, and wherein the control logic unit is further configured to determine the temperature for each of the plurality of remote sensors based on a frequency of its respective output signal.

12. The method as recited in claim 11, further comprising the control logic unit receiving a reference clock signal, wherein the control logic unit is configured to determine the reference frequency by determining a number of cycles of the reference signal occurring within a predetermined number of cycles of the reference clock signal and further configured to determine the frequency for each output signal by determining a number of cycles of each output signal occurring during the predetermined number of cycles of the reference clock signal.

13. The method as recited in claim 12, wherein the control logic unit is further configured to determine the temperature of each of the plurality of remote temperature sensors based on a temperature equation.

14. The method as recited in claim 11, wherein each ring oscillator includes an odd number of inverters and a resistor coupled to the output of each of the odd number of inverters.

15. The method as recited in claim 10, wherein the control logic unit is in a first voltage domain and wherein the reference sensor and each of the plurality of remote temperature sensors are in a second voltage domain.

16. The method as recited in claim 15, further comprising level shifters shifting the output signal from each of the plurality of remote temperature sensors from the second voltage domain to the first voltage domain.

17. The method as recited in claim 15, further comprising a level shifter shifting the signal having the reference frequency from the second voltage domain to the first voltage domain.