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Semiconductor device and manufacturing method of the same

  • US 7,456,083 B2
  • Filed: 03/02/2005
  • Issued: 11/25/2008
  • Est. Priority Date: 03/05/2004
  • Status: Active Grant
First Claim
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1. A method of manufacturing a semiconductor device, comprising:

  • providing a semiconductor wafer comprising a resin layer disposed on a front surface of the semiconductor wafer, a first electrode pad and a second electrode pad that are formed on the front surface, and a supporting member attached to the front surface by the resin layer, the semiconductor wafer comprising a plurality of semiconductor die regions;

    forming on a back surface of the semiconductor wafer a first alignment mark and a second alignment mark so that the first alignment mark is disposed in a first semiconductor die region and the second alignment mark is disposed in a second semiconductor die region that is next to the first semiconductor die region;

    detecting positions of the first and second alignment marks;

    calculating a middle position between the positions of the first and second alignment marks;

    aligning a blade with the calculated middle position on a side of the semiconductor wafer corresponding to the back surface; and

    cutting using the aligned blade at the calculated middle position the resin layer disposed on the front surface between the first and second electrode pads and along a predetermined direction.

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