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Apparatus for atomic layer deposition

  • US 7,456,429 B2
  • Filed: 03/29/2006
  • Issued: 11/25/2008
  • Est. Priority Date: 03/29/2006
  • Status: Active Grant
First Claim
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1. A distribution manifold for thin-film material deposition onto a substrate comprising:

  • a) a plurality of inlet ports comprising at least a first, a second, and a third inlet port capable of receiving a first, a second, and a third gaseous material, respectively;

    b) an output face comprising a plurality of open elongated output channels, each channel extending in a length direction substantially in parallel, the output channels comprising at least a first, a second, and a third output channel wherein the output channels are adjacent to each other along the output face, each output channel comprising an output port,wherein each output port, which is used to provide a flow of gaseous material to the corresponding output channel, allows gaseous flow communication with one of the first, the second, or the third inlet ports and is capable of substantially directing a flow of the corresponding one of the first, the second, and the third gaseous material along the length direction of the output channel towards an end of the output channel whereby the gaseous material is exhausted from the output channel at a position displaced along the length of output channel from the output port.

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