Electronic devices and its production methods

• US 7,456,497 B2
• Filed: 11/14/2003
• Issued: 11/25/2008
• Est. Priority Date: 12/27/2002
• Status: Expired due to Term

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Higashi, Mitsutoshi
• Primary Examiner(s): MENZ, LAURA MARY
• Application Number:
  US10/706,912
• Publication Number:
  US 20050167795A1
• Time in Patent Office: 1,838 Days
• Field of Search: 257/684, 257/678, 257/704
• US Class Current: 257/704
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An electronic device having mounted thereon an MEMS element or other functional elements, in which a device body and lid define an element-carrying space, the element-carrying space is sealed air-tight by an ultrasonic bonded part bonding the device body and the lid, and the element-carrying space having arranged inside it a system element secured to the device body and/or the lid by flip-chip connection.

Claims

1. An electronic device having mounted thereon a microelectromechanical system (MEMS) element comprising a micromachine component and an electronic component for operation of said micromachine component formed on a substrate of said MEMS element, in which:

a lid having wiring patterns is bonded to the substrate of said MEMS element covering an active surface of said substrate,

an operating space for said micromachine component is defined by said substrate and said lid,

electrodes of said MEMS element and wiring patterns of said lid are electrically connected at a bonded part of said substrate and said lid, and

a sealing portion is provided between said MEMS element and said lid immediately surrounding and adjacent to an outside of said bonded part.

2. The electronic device as set forth in claim 1, in which said bonded part is an ultrasonic bonded part of said substrate and said lid.

3. The electronic device as set forth in claim 1, in which said substrate and/or said lid further have a cavity at the side of said operating space.

4. The electronic device as set forth in claim 1, in which said sealing portion comprises a continuous ultrasonic bonded part formed in contact with an outer periphery of an operating space side of said substrate and said lid without interruption.

5. The electronic device as set forth in claim 1, in which said substrate and/or said lid further comprise conductor-filled vias formed passing through said substrate and/or said lid in a thickness direction.

6. The electronic device as set forth in claim 1, in which said sealing portion comprises a sealing resin.