Probe card that controls a temperature of a probe needle, test apparatus having the probe card, and test method using the test apparatus

• US 7,456,641 B2
• Filed: 05/15/2006
• Issued: 11/25/2008
• Est. Priority Date: 07/25/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, In-Su, Park, Soon-Jong, Bae, Young-Gil
• Primary Examiner(s): Nguyen; Vinh P
• Application Number:
  US11/434,419
• Publication Number:
  US 20070018664A1
• Time in Patent Office: 925 Days
• Field of Search: 324/754, 324760-762, 136/203, 136/225
• US Class Current: 324/750.03
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05

Abstract

Provided are a probe card, a test apparatus having the probe card, and a test method using the test apparatus. The probe card includes a probe substrate having a signal line, a probe needle connected to the signal line and fixed to the probe substrate, and a cooling unit for cooling the temperature of the probe needle. Therefore, the probe needles contacting each chip can be maintained at a certain low temperature without increasing the temperature. As a result, it is possible to pervent deformation of the probe needles and minimize an amount of impurities stuck to the probe needles.

Claims

1. A probe card comprising:

a probe substrate having a signal line;

a probe needle connected to the signal line and fixed to the probe substrate; and

a thermostat for controlling the temperature of the probe needle, wherein the thermostat comprises a temperature detection sensor contacting the probe needle to detect the temperature of the probe needle.

2. The probe card according to claim 1, wherein the thermostat comprises a cooling unit for lowering the temperature of the probe needle.

3. The probe card according to claim 2, wherein the thermostat further comprises a temperature controller for controlling drive of the cooling unit according to the temperature detected by the temperature detection sensor.

4. The probe card according to claim 2, wherein the cooling unit comprises a Peltier module for cooling the probe needle according to a predetermined direct current.

5. The probe card according to claim 4, wherein the Peltier module comprises a first metal member for absorbing heat of the probe needle to cool the probe needle, second metal members respectively connected to one end and the other end of the first metal member to emit the absorbed heat and formed of materials different from the first metal member, and a power source for supplying a predetermined direct current through ends of the second metal members to cool or heat the first and second metal members.

6. The probe card according to claim 5, wherein the thermostat further comprises a temperature detection sensor contacting the probe needle to detect the temperature of the probe needle, a switch for switching current supply of the power source, and a temperature controller for controlling operation of the switch according to the temperature detected by the temperature detection sensor.

7. The probe card according to claim 5, wherein the cooling unit further comprises a conductive radiating member contacting the second metal member to radiate heat generated from the second metal member to the exterior.

8. The probe card according to claim 5, wherein the cooling unit further comprises a heat absorbing member interposed between the first metal member and the probe needle.

9. The probe card according to claim 8, wherein the heat absorbing member is formed of an insulating material having a predetermined thickness.

10. A test apparatus comprising:

a wafer chuck for mounting a wafer having a plurality of chips;

a probe card having a probe needle contacting a pad of the chip to transmit an electrical signal to the chip, a probe substrate having a signal line to be connected to the probe needle, and a thermostat for controlling the temperature of the probe needle; and

a tester for generating a test signal to test the chip and transmitting the test signal to the probe card,

wherein the thermostat comprises a temperature detection sensor contacting the probe needle to detect the temperature of the probe needle.

11. The test apparatus according to claim 10, wherein the thermostat comprises a cooling unit for lowering the temperature of the probe needle.

12. The test apparatus according to claim 11, wherein the thermostat further comprises a temperature controller for controlling drive of the cooling unit according to the temperature detected by the temperature detection sensor.

13. The test apparatus according to claim 11, wherein the cooling unit comprises a Peltier module having a first metal member for absorbing heat of the probe needle to cool the probe needle, second metal members respectively connected to one end and the other end of the first metal member to emit the absorbed heat and formed of materials different from the first metal member, and a power source for supplying a predetermined direct current through ends of the second metal members to cool or heat the first and second metal members.

14. The test apparatus according to claim 13, wherein the thermostat further comprises a temperature detection sensor contacting the probe needle to detect the temperature of the probe needle, a switch for switching current supply of the power source, and a temperature controller for controlling operation of the switch according to the temperature detected by the temperature detection sensor.

15. The test apparatus according to claim 13, wherein the cooling unit further comprises a conductive radiating member contacting the second metal member to radiate heat generated from the second metal member, and a heat absorbing member interposed between the first metal member and the probe needle and formed of an insulating material having a predetermined thickness.

16. A test method, comprising:

bringing a probe needle into contact with a pad of a chip formed on a wafer;

transmitting a test signal to the chip through the pad; and

controlling the temperature of the probe needle,

wherein controlling the temperature of the probe needle further comprises detecting the temperature of the probe needle through a temperature detection sensor contacting the probe needle.

17. The test method according to claim 16, wherein controlling the temperature of the probe needle comprises lowering the temperature of the probe needle using a cooling unit.

18. The test method according to claim 17, wherein controlling the temperature of the probe needle further comprises controlling drive of the cooling unit according to the temperature detected by the temperature detection sensor.

19. The test method according to claim 17, wherein lowering the temperature of the probe needle comprises lowering the temperature of the probe needle using a Peltier module.

20. The test method according to claim 19, wherein controlling the temperature of the probe needle further comprises detecting the temperature of the probe needle through a temperature detection sensor, and switching current supply to the Peltier module according to the temperature detected by the temperature detecting sensor.

21. A probe card comprising:

a probe substrate having a signal line;

a probe needle connected to the signal line and fixed to the probe substrate; and

a thermostat for controlling the temperature of the probe needle,

wherein the thermostat comprises a cooling unit for lowering the temperature of the probe needle and the cooling unit comprises a Peltier module for cooling the probe needle according to a predetermined direct current,

wherein the Peltier module comprises a first metal member for absorbing heat of the probe needle to cool the probe needle, second metal members respectively connected to one end and the other end of the first metal member to emit the absorbed heat and formed of materials different from the first metal member, and a power source for supplying a predetermined direct current through ends of the second metal members to cool or heat the first and second metal members.

22. The probe card according to claim 21, wherein the thermostat further comprises a temperature detection sensor contacting the probe needle to detect the temperature of the probe needle, a switch for switching current supply of the power source, and a temperature controller for controlling operation of the switch according to the temperature detected by the temperature detection sensor.

23. The probe card according to claim 21, wherein the cooling unit further comprises a conductive radiating member contacting the second metal member to radiate heat generated from the second metal member to the exterior.

24. The probe card according to claim 21, wherein the cooling unit further comprises a heat absorbing member interposed between the first metal member and the probe needle.

25. The probe card according to claim 24, wherein the heat absorbing member is formed of an insulating material having a predetermined thickness.

26. A test apparatus comprising:

a wafer chuck for mounting a wafer having a plurality of chips;

a probe card having a probe needle contacting a pad of the chip to transmit an electrical signal to the chip, a probe substrate having a signal line to be connected to the probe needle, and a thermostat for controlling the temperature of the probe needle; and

a tester for generating a test signal to test the chip and transmitting the test signal to the probe card,

wherein the thermostat comprises a cooling unit for lowering the temperature of the probe needle, and

wherein the cooling unit comprises a Peltier module having a first metal member for absorbing heat of the probe needle to cool the probe needle, second metal members respectively connected to one end and the other end of the first metal member to emit the absorbed heat and formed of materials different from the first metal member, and a power source for supplying a predetermined direct current through ends of the second metal members to cool or heat the first and second metal members.

27. The test apparatus according to claim 26, wherein the thermostat further comprises a temperature detection sensor contacting the probe needle to detect the temperature of the probe needle, a switch for switching current supply of the power source, and a temperature controller for controlling operation of the switch according to the temperature detected by the temperature detection sensor.

28. The test apparatus according to claim 26, wherein the cooling unit further comprises a conductive radiating member contacting the second metal member to radiate heat generated from the second metal member, and a heat absorbing member interposed between the first metal member and the probe needle and formed of an insulating material having a predetermined thickness.