Wafer probe
First Claim
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1. A method of constructing a probe, said method comprising the steps of:
- (a) providing a circuit board including a plurality of conductive traces and a securement for a support;
(b) consolidating a plurality of elongate contact fingers each comprising a first end portion and a second end portion, said plurality of contact fingers maintained as a unity assembly by a tab interconnecting said contact fingers proximate one end of said contact fingers such that said plurality of contact fingers are maintained in a predetermined alignment with said first end portions spaced for contacting respective ones of a plurality of pads of a device under test and said second end portions spaced to engage respective ones of said conductive traces;
(c) conductively bonding said second end portions of said plurality of contact fingers to respective conductive traces, said first ends of said contact fingers extending beyond an edge of said circuit board; and
(d) removing said tab from said contact fingers.
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Abstract
The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
1063 Citations
13 Claims
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1. A method of constructing a probe, said method comprising the steps of:
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(a) providing a circuit board including a plurality of conductive traces and a securement for a support; (b) consolidating a plurality of elongate contact fingers each comprising a first end portion and a second end portion, said plurality of contact fingers maintained as a unity assembly by a tab interconnecting said contact fingers proximate one end of said contact fingers such that said plurality of contact fingers are maintained in a predetermined alignment with said first end portions spaced for contacting respective ones of a plurality of pads of a device under test and said second end portions spaced to engage respective ones of said conductive traces; (c) conductively bonding said second end portions of said plurality of contact fingers to respective conductive traces, said first ends of said contact fingers extending beyond an edge of said circuit board; and (d) removing said tab from said contact fingers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification