High frequency antenna device and method of manufacturing the same, HF antenna printed circuit board for HF antenna device, and transmitting and receiving device using HF antenna device

• US 7,456,790 B2
• Filed: 08/19/2005
• Issued: 11/25/2008
• Est. Priority Date: 11/05/2004
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Matsuura, Kazuo, Isono, Tadashi
• Primary Examiner(s): Le; HoangAnh T
• Application Number:
  US11/206,819
• Publication Number:
  US 20060097912A1
• Time in Patent Office: 1,194 Days
• Field of Search: 343/700.MS, 343/713, 343/711, 343/872, 343/712, 342/175, 342/70
• US Class Current: 343/700.0MS
• CPC Class Codes: G01S 13/931 of land vehicles
• CPC Class Codes: G01S 7/028 Miniaturisation, e.g. surface mounted device [SMD] packaging or housings
• CPC Class Codes: G01S 7/03 Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01Q 1/3233 particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H01Q 21/0093 Monolithic arrays
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

A high frequency antenna device is provided which includes: a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal; a plate-like metal base having a square opening cut therethrough; and a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base; wherein a periphery of the high frequency antenna wiring board is airtightly sealed and joined to the metal base with glass or brazing metal.

Claims

1. A high frequency antenna device comprising:

a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal;

a planar metal base having an opening cut therethrough; and

a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base;

wherein a periphery of the high frequency antenna wiring board is airtightly sealed and joined to the metal base with glass or brazing metal.

2. A high frequency antenna device according to claim 1, wherein the cover is joined to the metal base by welding.

3. A high frequency antenna device comprising:

a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal;

a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board; and

a planar metal ring attached to a periphery of the high frequency antenna wiring board;

wherein the metal ring and the high frequency antenna wiring board are airtightly sealed and joined with glass or brazing alloy to reinforce the high frequency antenna wiring board.

4. A method of manufacturing a high frequency antenna device comprising the steps of:

forming a film antenna on one surface of a dielectric substrate made up of multiple, laminated ceramic layers;

fitting the dielectric substrate in an opening cut through a planar metal base;

airtightly sealing and joining a periphery of the dielectric substrate to the metal base with glass or brazing alloy; and

after said sealing step, mounting electronic components of the high frequency circuit for generating a high frequency signal on the other surface of the dielectric substrate to form a high frequency antenna wiring board; and

covering a surface of the high frequency circuit on the high frequency antenna wiring board with a cover and welding the cover to the metal base for airtightly sealed packaging.

5. A high frequency antenna wiring board in a high frequency antenna device comprising:

a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal;

a planar metal base having an opening cut therethrough; and

a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base;

wherein input and output electrodes for the high frequency circuit are provided on the same surface of the dielectric substrate that the film antenna is formed; and

a periphery of the high frequency antenna wiring board is sealed airtight and joined with glass or brazing metal to the metal base.

6. A transmitting and receiving device comprising:

a high frequency antenna device for transmitting or receiving a high frequency signal;

a control circuit for controlling the high frequency antenna device; and

a signal processing circuit for processing an output signal of the high frequency antenna device;

wherein the high frequency antenna device comprises;

a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal;

a planar metal base having an opening cut therethrough; and

a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base by airtightly sealing and joining a periphery of the high frequency antenna wiring board to the metal base with glass or brazing alloy.

7. A transmitting and receiving device comprising:

a high frequency antenna device for transmitting or receiving a high frequency signal;

a control circuit for controlling the high frequency antenna device; and

a signal processing circuit for processing an output signal of the high frequency antenna device;

wherein the high frequency antenna device comprises;

a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal;

a planar metal ring attached to a periphery of the high frequency antenna wiring board and airtightly sealed and joined to the high frequency antenna wiring board with glass or brazing alloy; and

a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board.