Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging

• US 7,458,263 B2
• Filed: 11/18/2005
• Issued: 12/02/2008
• Est. Priority Date: 10/20/2003
• Status: Expired due to Term

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Nasiri, Steven S., Seeger, Joseph, Castro, Alexander, Flannery, Anthony Francis Jr., Lim, Martin
• Primary Examiner(s): Kwok; Helen C.
• Application Number:
  US11/283,083
• Publication Number:
  US 20060219006A1
• Time in Patent Office: 1,110 Days
• Field of Search: 735/10, 735/143.2, 735/142.9, 735/11, 735/041.4, 735/041.2, 735/040.4, 734/93, 734/31, 735/141.6
• US Class Current: 73/504.12
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01C 19/5712 the devices involving a micromechanical structure
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01C 19/574 the devices having two sensing masses in anti-phase motion

Abstract

A dual-axis sensor for measuring X and Y components of angular velocity in an X-Y sensor plane is provided. The dual-axis sensor includes a first subsensor for measuring the X component of angular velocity, and a second subsensor for measuring the Y component of angular velocity. The first subsensor and the second subsensor are contained within a single hermetic seal within the dual-axis sensor.

Claims

1. A dual-axis sensor for measuring X and Y components of angular velocity in an X-Y sensor plane, the dual-axis sensor comprising:

a first subsensor for measuring the X component of angular velocity; and

a second subsensor for measuring the Y component of angular velocity,

wherein both the first subsensor for measuring the X component of angular velocity and the second subsensor for measuring the Y component of angular velocity are contained together within a single hermetic seal within the dual-axis sensor.

2. The dual-axis sensor of claim 1, wherein the first subsensor and the second subsensor are separated by a barrier seal within the single hermetic seal, the barrier seal to reduce acoustic coupling between the first subsensor and the second subsensor.

3. The dual-axis sensor of claim 2, wherein the barrier seal includes one or more channels formed therein to permit pressure equalization on both the first subsensor and the second subsensor within the single hermetic seal.

4. The dual-axis sensor of claim 1, wherein the dual-axis sensor is fabricated using bulk silicon fabrication.

5. The dual-axis sensor of claim 1, wherein the first subsensor and the second subsensor are contained within a rectangular cavity of the dual-axis sensor, the dual-axis sensor further including a membrane formed over the rectangular cavity.

6. The dual-axis sensor of claim 5, further comprising one or more posts to support the membrane in the cavity.

7. The dual-axis sensor of claim 6, further comprising one or more posts to provide an anchor within the cavity from which a frame of the dual-axis sensor is suspended.

8. The dual-axis sensor of claim 6, further comprising one or more posts to support wafer level integration of a reference wafer associated with the dual-axis sensor, the reference wafer forming a lower portion of the single hermetic seal.

9. The dual-axis sensor of claim 6, wherein the posts provide temporary support of the membrane during the fabrication of mechanical elements associated with the first subsensor and the second subsensor.

10. The dual-axis sensor of claim 1, further comprising stress isolation features for sense mode frequency.

11. The dual-axis sensor of claim 10, wherein the stress isolation features feature comprise of one or more beams.

12. The dual-axis sensor of claim 1, further comprising stress isolation features for robustness during fabrication of the dual-axis sensor.

13. The dual-axis sensor of claim 1, wherein a sense mode frequency of the dual-axis sensor is less than a drive mode frequency of the dual-axis sensor.

14. The dual-axis sensor of claim 1, further comprising a frame including one or more tabs or grooves to limit motion of mechanical elements associated with the first subsensor and the second subsensor.

15. The dual-axis sensor of claim 1, wherein:

the first subsensor comprises;

a) a first sensing subassembly comprising;

i) a substantially planar first frame parallel to the X-Y sensor plane;

ii) a first mass disposed in the X-Y sensor plane;

iii) a second mass disposed in the X-Y sensor plane laterally to the first mass; and

iv) a first linkage within the first frame and connected to the first frame, wherein

the first linkage is connected to the first mass and to the second mass and wherein the first linkage constrains the first and second masses to move in opposite directions perpendicular to the X-Y sensor plane;

b) a first actuator for driving a first portion of the first sensing subassembly into oscillation at a drive frequency; and

c) a first transducer for sensing motion of a second portion of the first sensing subassembly responsive to the X component of angular velocity; and

the second subsensor comprises;

a) a second sensing subassembly comprising;

i) a substantially planar second frame parallel to the X-Y sensor plane;

ii) a third mass disposed in the X-Y sensor plane;

iii) a fourth mass disposed in the X-Y sensor plane laterally to the third mass; and

iv) a second linkage within the second frame and connected to the second frame,

wherein the second linkage is connected to the third mass and to the fourth mass and

wherein the second linkage constrains the third and fourth masses to move in opposite directions perpendicular to the X-Y sensor plane;

b) a second actuator for driving a first portion of the second sensing subassembly into oscillation at a drive frequency; and

c) a second transducer for sensing motion of a second portion of the second sensing subassembly responsive to the Y component of angular velocity.

16. The dual-axis sensor of claim 15, wherein the first and second linkages are designed such that in the presence of undesired Z-axis motion, lateral motion is limited by tab and grooves within the dual-axis sensor.

17. The dual-axis sensor of claim 15, wherein the first and second linkages comprise one or more beams.

18. The dual-axis sensor of claim 15, wherein drive motions of the first, second, third, and fourth masses are sensed indirectly.

19. The dual-axis sensor of claim 15, wherein the first, second, third, and fourth masses are actuated indirectly.

20. The dual-axis sensor of claim 19, further comprising one or more split electrodes to indirectly actuate the first, second, third, and fourth masses.

21. The dual-axis sensor of claim 20, wherein the one or more split electrodes are located on edge plates associated with the dual-axis sensor.

22. The dual-axis sensor of claim 15, further comprising one or more electrodes disposed on the first and second frames to differentially sense motion of the first and second frames.

23. The dual-axis sensor of claim 1, further comprising one or more actuators to actuate rotation of a frame of the dual-axis sensor during a self-test mode of operation for measurement of a sense mode frequency associated with the dual-axis sensor.

24. The dual-axis sensor of claim 23, wherein each of the one or more actuators are electrostatic actuators.

25. The dual-axis sensor of claim 24, wherein one or more of the electrostatic actuators utilizes a parallel plate electrode configuration or a comb finger electrode configuration.

26. The dual-axis sensor of claim 1, further comprising one or more shields to shield one or more mechanical elements associated with the first subsensor and the second subsensor from electromagnetic interference (EMI).

27. The dual-axis sensor of claim 1, wherein the first subsensor and the second subsensor are operated at frequencies separated by more than 500 Hz.