Lithographic apparatus and device manufacturing method

• US 7,459,247 B2
• Filed: 12/27/2004
• Issued: 12/02/2008
• Est. Priority Date: 12/27/2004
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: De Smit, Joannes Theodoor, Bijnen, Fransiscus Godefridus Casper
• Primary Examiner(s): Young; Christopher G
• Application Number:
  US11/020,561
• Publication Number:
  US 20060141373A1
• Time in Patent Office: 1,436 Days
• Field of Search: 430/22, 430/30, 356/399, 356/401
• US Class Current: 430/22
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70791 Large workpieces, e.g. glass substrates for flat panel displays or solar panels
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment

Abstract

A system and method use a substrate with a pattern of individual, indiscrete alignment marks, i.e., the marks are separate and distinct from each other, and each mark is not divided into component parts. The pattern of marks is distributed over an area of the substrate, and the method also comprises the steps of providing a beam of radiation using an illumination system and an array of individually controllable elements to impart the beam with a pattern in its cross-section, providing a projection system to project the patterned beam onto the substrate, and providing a movement system to effect relative movement between the substrate and the projection system. A detection system, able to detect the alignment marks individually, is also provided, and the method includes using the detection system to detect the marks to determine a relative position of the substrate to the projection system, using the movement system to position the substrate relative to the projection system, and using the projection system to project the patterned beam of radiation onto a target portion of the substrate. The pattern comprises one or more rows of simple alignment marks, such as spots and short linear marks.

Claims

1. A device manufacturing method, comprising:

forming a pattern of individual, indiscrete alignment marks on a substrate, the alignment marks being distributed over an area of the substrate;

using an array of individually controllable elements to pattern a beam of radiation;

projecting the patterned beam onto the substrate using a projection system;

effecting relative movement between the substrate and the projection system using a movement system;

detecting the alignment marks individually;

determining a relative position of the substrate to the projection system based on the detecting step;

positioning the substrate relative to the projection system using the movement system; and

projecting the patterned beam of radiation onto a target portion of the substrate.

2. The method of claim 1, wherein at least one of the alignment marks is circular.

3. The method of claim 1, wherein at least one of the alignment marks is a spot.

4. The method of claim 1, wherein at least one of the alignment marks is linear.

5. The method of claim 1, wherein:

the patterned beam comprises a plurality of spots having a common size; and

at least some of the alignment marks are spots having substantially a same size.

6. The method of claim 1, wherein the alignment marks have substantially different reflective characteristics from the substrate.

7. The method of claim 1, wherein the pattern of alignment marks comprises a row of alignment marks.

8. The method of claim 7, wherein the row extends along a length of the substrate.

9. The method of claim 7, further comprising:

projecting the patterned beam onto one or more of the target portions to deliver a radiation dose pattern over a target area of the substrate, wherein the row is arranged outside the target area.

10. The method of claim 9, wherein the row is adjacent the target area.

11. The method of claim 9, wherein the row is adjacent an edge of the substrate.

12. The method of claim 7, further comprising:

projecting the patterned beam onto one or more of the target portions to deliver a radiation dose pattern over a target area of the substrate, wherein the row is inside the target area.

13. The method of claim 8, wherein the alignment marks of the row are spaced apart, such that the intervals between adjacent marks in the row vary along the length of the substrate in a predetermined manner.

14. The method of claim 13, wherein:

the row is a first row;

the pattern of alignment marks comprises a second, associated row of alignment marks, the associated row being parallel to the first row, and

the alignment marks of the associated row are spaced apart, such that the intervals between adjacent marks in the associated row vary along the length of the substrate in a predetermined manner related to that of the first row.

15. The method of claim 14, further comprising:

using the detection system to monitor the first row and the associated row, and

using both the rows to determine a position of the substrate in a direction parallel to the rows.

16. The method of claim 15, wherein the predetermined manners in which the intervals of the first row and associated row vary are arranged such that the determination of the position of the substrate in a direction parallel to the rows is achieved with substantially constant resolution.

17. The method of claim 14, further comprising:

using the detection system to monitor the first row and the associated row; and

using both the rows to determine a position of the substrate in a direction perpendicular to the rows.

18. The method of claim 17, wherein the row is arranged to extend across a width of the substrate.

19. The method of claim 18, wherein the row comprises a plurality of linear alignment marks, each extending in a direction transverse to the row.

20. The method of claim 19, wherein:

the row of alignment marks has a substantially uniform pitch;

the detection system comprises an array of lenses have a substantially uniform different pitch; and

the step of using the detection system to detect the alignment marks comprises observing the row of alignment marks through the array of lenses.

21. The method of claim 1, wherein the pattern of alignment marks comprises a plurality of rows of alignment marks.

22. The method of claim 21, wherein the plurality of rows comprises a first row and a second row parallel to the first.

23. The method of claim 22, further comprising:

projecting the patterned beam onto one or more target portions to deliver a radiation dose pattern over a target area of the substrate, wherein the first and second rows are arranged such that the target area is between them.

24. The method of claim 22, wherein the first row is arranged proximate an edge of the substrate and the second row is arranged proximate an opposite edge of the substrate.

25. The method of claim 21, wherein the plurality of rows comprises four parallel rows and the method further comprises:

using the detection system to monitor all four rows; and

using all four rows to determine a position of the substrate in a direction perpendicular to the rows.

26. The method of claim 25, wherein:

the detection system comprises an array of lenses having a substantially uniform pitch;

the four rows are spaced apart by distances related to the lens array pitch; and

the step of using the detection system to detect the alignment marks comprises observing the four rows of alignment marks through the array of lenses.

27. The method of claim 1, wherein the pattern of alignment marks is arranged to extend over at least 80% of at least one of the length and width of the substrate.

28. The method of claim 1, further comprising:

projecting the patterned beam onto one or more target portions to deliver a radiation dose pattern over a target area of the substrate, wherein the pattern comprises alignment marks arranged inside the target area.

29. The method of claim 28, further comprising:

providing alignment marks inside the target area at substrate locations on which no device layers are to be formed.

30. The method of claim 1, wherein the step of using the detection system to detect the alignment marks comprises using at least one camera to observe the marks.

31. The method of claim 1, wherein the step of using the detection system to detect the alignment marks comprises using at least one detector to detect radiation reflected from the substrate and through an array of lenses distributed over an area of the substrate.

32. The method of claim 31, further comprising using the array of lenses to project the patterned beam onto the substrate.

33. The method of claim 1, further comprising:

using the movement system to move the substrate relative to the projection system; and

using a signal from the detection system to control a speed of the movement.

34. The method of claim 1, further comprising:

using the movement system to move the substrate relative to the projection system; and

using a signal from the detection system to control the array of individually controllable elements while the substrate is moving.