Protection layers in micromirror array devices
First Claim
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1. A method of fabricating a micromirror device, comprising:
- depositing first and second sacrificial layers on a substrate;
forming a reflective mirror plate on one of the first or second sacrificial layers;
forming a deformable hinge on the other sacrificial layer;
depositing a protection layer on the formed deformable hinge;
removing the sacrificial layer and protection layer so as to free the mirror plate.
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Abstract
To protect the structural layers from being eroded in the etching process, a protection layer is deposited on the exposed structural layers of the micromirror. The protection layer is deposited before etching and removed after etching.
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Citations
26 Claims
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1. A method of fabricating a micromirror device, comprising:
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depositing first and second sacrificial layers on a substrate; forming a reflective mirror plate on one of the first or second sacrificial layers; forming a deformable hinge on the other sacrificial layer; depositing a protection layer on the formed deformable hinge; removing the sacrificial layer and protection layer so as to free the mirror plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method of fabricating a hinged MEMS device, comprising:
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depositing a sacrificial layer on a substrate; depositing and patterning a flexible hinge structure and a rigid movable member after depositing the sacrificial layer; depositing a protection layer on the flexible hinge; removing the sacrificial layer and the protection layer so as to release the MEMS device, wherein the depositing of a sacrificial layer on a substrate comprises depositing a first and second sacrificial layer on the substrate, wherein the depositing and patterning of the hinge and movable member comprise, after depositing the first sacrificial layer, depositing and patterning the movable member, followed by depositing the second sacrificial layer, followed by depositing and patterning the hinge structure.
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26. A method of making a MEMS device, comprising:
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on an array of movable plates connected to a substrate, depositing a sacrificial layer; on the sacrificial layer, depositing a hinge layer and patterning the hinge layer into an array of hinges; on the array of hinges, depositing a protection layer; and removing the sacrificial layer and the protection layer.
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Specification