RIM slot filler module and method of manufacturing the same

• US 7,459,642 B2
• Filed: 09/30/2002
• Issued: 12/02/2008
• Est. Priority Date: 09/30/2002
• Status: Expired due to Fees

• Current Assignee: Teradyne Incorporated
• Original Assignee: Teradyne Incorporated
• Inventors: Culpepper, Martin L., Girdhar, Rohit, Patel, Sarosh M.
• Primary Examiner(s): Ngo; Hung V
• Application Number:
  US10/261,006
• Publication Number:
  US 20050231920A1
• Time in Patent Office: 2,255 Days
• Field of Search: 174/521, 361/724, 361/727, 361/688, 361/690, 361/728
• US Class Current: 174/521
• CPC Class Codes: H05K 7/1429 for circuits carrying a CPU and adapted to receive expansion cards

Abstract

A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate a first end of the RIM molded encapsulant.

Claims

1. A slot filler module for replacing an optional electronics module in a system, comprising:

a reaction injection molded (RIM) encapsulant;

a connector assembly disposed proximate a first end of said encapsulant; and

at least one insert disposed in a predetermined location embedded within said encapsulant,

wherein said encapsulant and said at least one insert have approximately the same mass as the electronics module, and

wherein the connector assembly comprises;

at least one threaded insert disposed in said module;

a connector disposed over said at least one threaded insert; and

a fastener removably insertable within the at least one threaded insert, the fastener securing the connector to the module.

2. The slot filler module of claim 1 wherein said at least one insert is disposed in a predetermined location embedded within said encapsulant to provide a center of mass of said module in a predetermined location.

3. The slot filler module of claim 1 further comprising an ESD sheet disposed over at least a portion of a first surface of said encapsulant.

4. The slot filler module of claim 1 further comprising a latch assembly disposed proximate a second end of said encapsulant.

5. The slot filler module of claim 1 wherein said at least one insert is comprised of steel.

6. The slot filler module of claim 1 wherein said encapsulant is selected from the group consisting of rigid urethanes, urethane elastomers, and urethane foams.

7. The slot filler module of claim 1 wherein at least one surface of said encapsulant is generally smooth and is able to withstand compressive forces.

8. The slot filler module of claim 1 further comprising a guide disposed along at least a first portion of said module.

9. The slot filler module of claim 1 further comprising a handle disposed at a second end of said module.

10. The slot filler module of claim 1 wherein said at least one insert is in electrical communication with a reference potential.

11. A slot filler module for replacing an optional electronics module in a system, comprising:

a reaction injection molded (RIM) encapsulant;

a latch assembly disposed proximate a second end of said encapsulant; and

at least one insert disposed in a predetermined location embedded within said encapsulant,

wherein said encapsulant and said at least one insert have approximately the same mass as the electronics module,

wherein said latch assembly comprises;

at least one threaded insert disposed in said module,

a latch plate disposed over said at least one threaded insert; and

a fastener removably insertable within said at least one threaded insert, said fastener securing said latch plate to said module.

12. A slot filler module for replacing an optional electronics module in a system, comprising:

a reaction injection molded (RIM) encapsulant;

a connector assembly disposed proximate a first end of said encapsulant;

a cover disposed over at least a portion of said connector assembly; and

at least one insert disposed in a predetermined location embedded within said encapsulant,

wherein said encapsulant and said at least one insert have approximately the same mass as the electronics module.

13. The slot filler module of claim 12 wherein said at least one insert is disposed in a predetermined location embedded within said encapsulant to provide a center of mass of said module in a predetermined location.

14. The slot filler module of claim 12, further comprising an ESD sheet disposed over at least a portion of a first surface of said encapsulant.

15. The slot filler module of claim 12, further comprising a latch assembly disposed proximate a second end of said encapsulant.

16. The slot filler module of claim 12 wherein said at least one insert is comprised of steel, and

wherein said encapsulant is selected from the group consisting of rigid urethanes, urethane elastomers, and urethane foams.

17. The slot filler module of claim 12 wherein at least one surface of said encapsulant is generally smooth and is able to withstand compressive forces.

18. The slot filler module of claim 12, further comprising a guide disposed along at least a first portion of said module.

19. The slot filler module of claim 12, further comprising a handle disposed at a second end of said module.

20. The slot filler module of claim 12 wherein said at least one insert is in electrical communication with a reference potential.