Systems and methods for integrating focal plane arrays
First Claim
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1. A wafer-level packaged focal plane array assembly, comprising:
- a device wafer, said device wafer comprising a multi-band focal plane array; and
a lid wafer, said lid wafer being at least partially transparent to visible and infrared radiation and being assembled to said device wafer so that said lid wafer allows visible radiation to reach said multi-band focal plane array through said lid wafer;
wherein said multi-band focal plane array comprises a plurality of detector elements, each of said detector elements comprising;
a substrate,read out integrated circuitry (ROIC) disposed on said substrate, said ROIC including visible imaging circuitry configured to detect visible radiation, andan infrared radiation detector structure configured to absorb infrared radiation, said infrared detector structure comprising a membrane supported at a position spaced above said substrate, said membrane having at least one opening defined therein and configured to allow visible spectrum radiation to reach said visible imaging circuitry through said membrane.
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Abstract
Systems and methods for providing multi-spectral image capability using an integrated multi-band focal plane array that, in one example, may be employed to simultaneously image in the visible spectrum and infrared spectrum using an integrated dual-band focal plane array, e.g., by including visible imaging circuitry within read out integrated circuitry (ROIC) used to readout infrared detector elements within the same pixel element/s.
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Citations
45 Claims
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1. A wafer-level packaged focal plane array assembly, comprising:
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a device wafer, said device wafer comprising a multi-band focal plane array; and a lid wafer, said lid wafer being at least partially transparent to visible and infrared radiation and being assembled to said device wafer so that said lid wafer allows visible radiation to reach said multi-band focal plane array through said lid wafer; wherein said multi-band focal plane array comprises a plurality of detector elements, each of said detector elements comprising; a substrate, read out integrated circuitry (ROIC) disposed on said substrate, said ROIC including visible imaging circuitry configured to detect visible radiation, and an infrared radiation detector structure configured to absorb infrared radiation, said infrared detector structure comprising a membrane supported at a position spaced above said substrate, said membrane having at least one opening defined therein and configured to allow visible spectrum radiation to reach said visible imaging circuitry through said membrane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A detector element, comprising:
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a substrate; read out integrated circuitry (ROIC) disposed on said substrate, said ROIC including visible imaging circuitry configured to detect visible spectrum radiation; a substantially planar infrared detector membrane, said membrane having a pianar upper surface, said membrane having at least one opening defined therein that is configured to allow visible radiation to reach said visible imaging circuitry through said membrane; and at least one thermal isolation leg supporting said infrared detector membrane in a position that is spaced above said substrate, said thermal isolation leg having a first end positioned proximal to said membrane and a second end positioned distal to said membrane, an upper surface of said first end of said thermal isolation leg being configured to lie in the same plane as the upper surface of said second end of said thermal isolation leg; wherein a substantial entirety of the upper surface of said at least one thermal isolation leg is substantially planar and is oriented in substantially parallel and substantially coplanar relationship with said planar upper surface of said substantially planar infrared detector membrane. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A wafer-level packaged focal plane array assembly, comprising:
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a device wafer, said device wafer comprising a focal plane array assembly; and a lid wafer, said lid wafer being at least partially transparent to infrared radiation and being assembled to said device wafer so that said lid wafer allows infrared radiation to reach said focal plane array assembly through said lid wafer; wherein said focal plane array assembly comprises; a substrate, and a plurality of multi-band detector elements, each of said plurality of multi-band detector elements comprising a membrane suspended over said substrate and read out integrated circuitry (ROIC) disposed on said substrate, said ROIC including visible imaging circuitry, wherein said membrane of each of said multi-band detector elements has at least one opening defined therein and is configured to allow visible spectrum radiation to reach said visible imaging circuitry through said membrane. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A method of making a wafer-level packaged focal plane array assembly, comprising:
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providing a device wafer, said device wafer comprising a substrate; providing a focal plane array assembly of multi-band detector elements on said device wafer by; forming read out integrated circuitry (ROIC) on said first side of said substrate for said multi-band detector elements of said focal plane array assembly, said ROIC including visible imaging circuitry, forming a plurality of membrane structures on said substrate so that each of said membrane structures corresponds to a respective multi-band detector element and is suspended over said substrate with said ROIC disposed on said substrate, and forming at least one opening in each of said plurality of membrane structures corresponding to a respective multi-band detector element, said opening being configured to allow visible spectrum radiation to reach said visible imaging circuitry of said respective multi-band detector element through said membrane of said respective multi-band detector element; providing a lid wafer, said lid wafer being at least partially transparent to infrared radiation; and assembling said lid wafer to said device wafer to form said wafer-level packaged focal plane array assembly, and so that said lid wafer allows infrared radiation to reach said focal plane array assembly through said lid wafer. - View Dependent Claims (34, 35, 36, 37, 38, 39)
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40. A multi-band detector element, comprising:
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a substrate; a first radiation detector structure disposed on said substrate, said first radiation detector structure configured to detect a radiation having a first wavelength; a second radiation detector structure configured to absorb radiation having a second wavelength; and a third radiation detector structure configured to absorb radiation having a third wavelength. - View Dependent Claims (41, 42, 43)
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44. A multi-band radiation detection system, comprising:
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a multi-band focal plane array comprising a plurality of multi-band detector elements, each of said multi-band detector elements comprising; a substrate, read out integrated circuitry (ROIC) disposed on said substrate, said ROIC including visible imaging circuitry configured to detect visible radiation, and an infrared radiation detector structure configured to absorb infrared radiation, said infrared detector structure comprising a membrane supported at a position spaced above said substrate, said membrane having at least one opening defined therein and configured to allow visible spectrum radiation to reach said visible imaging circuitry through said membrane; and a periodic chopper positioned between said focal plane array and a source of visible spectrum radiation and infrared spectrum radiation; wherein said periodic chopper comprises a color-correcting chopper having a first portion and a second portion, said first portion being configured to allow said visible spectrum radiation to be focused on said focal plane array and said second portion being configured to focus said infrared spectrum radiation on said focal plane array.
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45. A multi-band radiation detection system, comprising:
a focal plane array assembly, said focal plane array assembly comprising; a substrate, and a plurality of multi-band detector elements, each of said plurality of multi-band detector elements comprising a membrane suspended over said substrate and read out integrated circuitry (ROIC) disposed on said substrate, said ROIC including visible imaging circuitry.
Specification