Chip inductor and method for manufacturing the same

• US 7,460,000 B2
• Filed: 11/17/2004
• Issued: 12/02/2008
• Est. Priority Date: 01/23/2004
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kawaguchi, Masahiko, Kudo, Hayami, Nakata, Yasuhiro
• Primary Examiner(s): Enad; Elvin G
• Assistant Examiner(s): BAISA, JOSELITO SASIS
• Application Number:
  US10/556,700
• Publication Number:
  US 20070069844A1
• Time in Patent Office: 1,476 Days
• Field of Search: 336/200
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00

Abstract

A chip inductor is constructed by alternately laminating plural conductor patterns and plural insulating layers on and above a ceramic substrate, and connecting the plural conductor patterns to each other in series in a lamination direction thereof so as to constitute a coil. Specifically, the number of turns of the lowermost conductor pattern disposed directly on the ceramic substrate is larger than the number of turns of the other plural conductor patterns and the number of turns of the other plural conductor patterns are substantially equal to each other. Preferably, the number of turns of the lowermost conductor pattern is about 1.5 times the number of turns of the other plural conductor patterns.

Claims

1. A chip inductor comprising:

a chip main body and a pair of external connection electrodes, the chip main body including a substrate and a laminate including plural conductor patterns and plural insulating layers alternately laminated on the substrate, each conductor pattern including turns, the plural conductor patterns are connected to each other in series in a lamination direction thereof so as to constitute a coil, one of the external connection electrodes attached to one side-end surface of the chip main body and connected to one end of the coil, and the other external connection electrode attached to the other side-end surface of the chip main body and connected to the other end of the coil;

wherein

outer diameter dimensions of the plural conductor patterns constituting the coil are substantially equal; and

a thickness of the laminate body and a thickness of the substrate are substantially equal, so that a lowermost-layer conductor pattern is located substantially in a midsection of the chip main body;

the lowermost-layer conductor pattern is the conductor pattern having the largest number of turns, and a number of turns of the other plural conductor patterns are substantially equal to each other; and

the number of turns of the lowermost-layer conductor pattern is about 1.5 turns, and the number of turns of the other conductor patterns is about 1 turn.

2. The chip inductor according to claim 1, wherein each of the external connection electrodes has a shape substantially similar to a square bracket and extending from a top surface of the chip main body to a bottom surface along each side-end surface of the chip main body.

3. The chip inductor according to claim 1, wherein the conductor pattern in the lower half of the plural conductor patterns having the largest number of turns is arranged so as to prevent magnetic fluxes generated by the coil from passing through portions of the external connection electrodes located on a top surface and a bottom surface of the chip main body.

4. The chip inductor according to claim 1, further comprising openings disposed in the plural insulating layers, wherein the plural conductor patterns are connected in series in the lamination direction through the openings disposed in the plural insulating layers so as to constitute the coil.

5. The chip inductor according to claim 1, wherein the substrate comprises a ceramic substrate or a wafer, the conductor patterns are made of a photosensitive conductor paste, and the insulating layers are made of an insulating material paste.

6. The chip inductor according to claim 1, wherein line widths of the plural conductor patterns are substantially equal to each other.

7. A method for manufacturing a chin inductor comprising the steps of:

alternately repeating a step of forming a conductor pattern and a subsequent step of forming an insulating layer a plurality of times on a ceramic substrate or a wafer so as to form a chip main body, each conductor pattern including turns;

connecting the plural conductor patterns to each other in series in a lamination direction thereof so as to produce a chip inductor including a coil;

forming a number of turns of a lowermost-layer conductor pattern to be larger than a number of turns of the other plural conductor patterns; and

forming the number of turns of the other plural conductor patterns to be substantially equal to each other;

wherein

the number of turns of the lowermost-layer conductor pattern is about 1.5 turns, and the number of turns of the other plural conductor patterns is about 1 turn.

8. The method for manufacturing a chip inductor according to claim 7, further comprising providing a pair of external connection electrodes, one of the external connection electrodes attached to one side-end surface of the chip main body and connected to one end of the coil, and the other external connection electrode attached to the other side-end surface of the chip main body and connected to the other end of the coil.

9. The method for manufacturing a chip inductor according to claim 8, wherein the conductor pattern in the lower half of the plural conductor patterns having the largest number of turns is arranged so as to prevent magnetic fluxes generated by the coil from passing through portions of the external connection electrodes located on a top surface and a bottom surface of the chip main body.

10. The method for manufacturing a chip inductor according to claim 7, further comprising the step of disposing openings in the insulating layers, and connecting the plural conductor patterns to each other in series in the lamination direction thereof through the openings so as to constitute the coil.

11. The method for manufacturing a chip inductor according to claim 7, wherein the steps of forming the conductor patterns and the insulating layers include forming the conductor patterns by patterning and firing a photosensitive conductor paste and firing an insulating material paste, respectively.

12. The method for manufacturing a chip inductor according to claim 7, wherein line widths of the plural conductor patterns are substantially equal to each other.