Overlay measurement methods with firat based probe microscope
First Claim
1. A method for determining alignment of layers in a semiconductor device comprising the actions of:
- providing a first layer having detectable surface and subsurface material properties;
positioning a photoresist layer over said first layer, said photoresist layer having detectable surface and subsurface material properties;
imaging said first layer and said photoresist layer with a dual tip probe devicecomparing the detectable material properties; and
mapping an alignment of the compared detectable material properties,wherein the dual tip probe comprises;
a detection surface;
a force sensor attached to said detection surface, said force sensor comprising;
a pair of flexible mechanical structures each disposed a first distance above the detection surface so as to form a gap between the flexible mechanical structure and the detection surface, wherein each flexible mechanical structure is configured to independently deflect upon exposure to an external force, thereby changing the first distance;
a probe tip disposed on an outer surface of each flexible mechanical structure;
an actuator coupled to each flexible mechanical structure configured to apply force to the flexible mechanical structure; and
a detector configured to measure deflection of each said flexible mechanical structure.
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Accused Products
Abstract
A method, system and unit for determining alignment in a layered device such as a semiconductor device includes providing a first layer having detectable surface and subsurface material properties and positioning a patterned photoresist layer over the first layer, patterned photoresist layer having detectable surface and subsurface material properties. The layers are imaged with a FIRAT probe to detect the material properties, and the detectable material properties are compared for mapping an alignment of the compared detectable material properties. The first layer may be a substrate or have a previously processed layer formed thereon. A surface topography may be included over the substrate and an etchable layer formed over the substrate or first layer. The FIRAT probe may be a single tip probe or a dual tip probe.
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Citations
27 Claims
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1. A method for determining alignment of layers in a semiconductor device comprising the actions of:
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providing a first layer having detectable surface and subsurface material properties; positioning a photoresist layer over said first layer, said photoresist layer having detectable surface and subsurface material properties; imaging said first layer and said photoresist layer with a dual tip probe device comparing the detectable material properties; and mapping an alignment of the compared detectable material properties, wherein the dual tip probe comprises; a detection surface; a force sensor attached to said detection surface, said force sensor comprising; a pair of flexible mechanical structures each disposed a first distance above the detection surface so as to form a gap between the flexible mechanical structure and the detection surface, wherein each flexible mechanical structure is configured to independently deflect upon exposure to an external force, thereby changing the first distance; a probe tip disposed on an outer surface of each flexible mechanical structure; an actuator coupled to each flexible mechanical structure configured to apply force to the flexible mechanical structure; and a detector configured to measure deflection of each said flexible mechanical structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification