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Method of treating and probing a via

  • US 7,461,771 B2
  • Filed: 04/22/2005
  • Issued: 12/09/2008
  • Est. Priority Date: 04/22/2005
  • Status: Expired due to Fees
First Claim
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1. A method of treating a via connected with a substrate, comprising:

  • aligning a stencil with the substrate, the stencil including a pattern with a plurality of apertures and a shield;

    connecting the stencil with the substrate so that the shield covers a hole and a first portion of a pad of the via, and the apertures are positioned over a second portion of the pad;

    applying a lead-free solder paste to the stencil to print the paste directly upon the second portion only, the shield preventing the paste from entering the hole;

    removing the stencil from the substrate; and

    reflowing the paste so that a flux drains through the hole and separate sections of lead-free solder are positioned around the hole directly upon the pad and wet only a portion of a surface area of the pad, the hole remaining unobstructed, the separate sections of lead-free solder exposed to receive an electrical test probe.

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