Methods and systems relating to solid state light sources for use in industrial processes

• US 7,461,949 B2
• Filed: 01/26/2006
• Issued: 12/09/2008
• Est. Priority Date: 05/08/2002
• Status: Expired due to Term

• Current Assignee: Phoseon Technology, Inc.
• Original Assignee: Phoseon Technology, Inc.
• Inventors: Anderson, Duwayne R., Owen, Mark D., Jasmin, Roland, Schreiner, Alex
• Primary Examiner(s): O'Seha; Sandra L
• Assistant Examiner(s): Dunwiddie; Meghan K.
• Application Number:
  US11/342,363
• Publication Number:
  US 20070278504A1
• Time in Patent Office: 1,048 Days
• Field of Search: 362/231, 362/252, 362/373, 362/800, 313/500, 313/512, 257 98-100
• US Class Current: 362/249.16
• CPC Class Codes: G11B 7/26 Apparatus or processes specially adapted for the manufacture of record carriers
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

Methods and systems relating to solid state light sources for use in industrial processes.

Claims

1. A light module comprising:

an array of solid-state light emitters mounted on or formed in a thermally transmissive substrate providing electrical circuitry patterns for coupling with the solid-state emitters, the substrate comprising a ceramic or semiconductor material comprising one or more of alumina, aluminum nitride, sapphire, silicon carbide, and/or semiconductor silicon wherein the density of light emitters in the array is at least 1 emitter per 6.25 mm²;

a lens array layer disposed over the array of solid-state emitters, the lens array having a plurality of lenses formed therein, each lens being optically coupled to one or more light emitters, the lens array being adjacent to the emitters and the substrate surrounding individual emitters;

a temperature control system for dissipating heat away from the light emitters; and

wherein the lens array layer and lenses formed therein comprise a monolithically molded layer of material in direct contact with the emitters and surrounding substrate.

2. The light module of claim 1, wherein the molded material comprises a gel.

3. The light module of claim 1, wherein the molded material comprises an epoxy, gel, acrylic, urethane, or moldable glass.

4. The light module of claim 1 wherein the temperature control system comprises one or more coolant channels or tubes adjacent the substrate.

5. A light module comprising:

an array of solid-state light emitters mounted on or formed in a thermally transmissive substrate providing electrical circuitry patterns for coupling with the solid-state emitters, the substrate comprising a ceramic or semiconductor material

wherein the density of light emitters in the array is at least 1 emitter per 6.25 mm²;

a lens array layer disposed over the array of solid-state emitters, the lens array having a plurality of lenses formed therein, each lens being optically coupled to one or more light emitters, the lens array being adjacent to the emitters and the substrate surrounding individual emitters;

a temperature control system for dissipating heat away from the light emitters; and

wherein the module is associated with a power control subsystem that controls power so that, as to at least one of the plurality of solid-state light emitters, the power waveform is any one of, or any combination of two or more of;

pulsed power supplied at regular, repeating or varying on/off periods or frequencies;

pulsed power supplied at any of various current levels;

pulsed power supplied at currents greater than the solid-state light emitter'"'"'s specifications;

pulsed power supplied at varying current levels;

pulsed power supplied at ramped up current levels;

pulsed power supplied at ramped down current levels;

arbitrary voltage and current supplied at any of various pulse repetition rates and duty cycles; and

/or power supplied with sinusoidal or sinusoid-like variations in current levels.

6. A light module comprising:

an array of solid-state light emitters mounted on or formed in a thermally transmissive substrate providing electrical circuitry patterns for coupling with the solid-state emitters, the substrate comprising a ceramic or semiconductor material

wherein the density of light emitters in the array is at least 1 emitter per 6.25 mm²;

a lens array layer disposed over the array of solid-state emitters, the lens array having a plurality of lenses formed therein, each lens being optically coupled to one or more light emitters, the lens array being adjacent to the emitters and the substrate surrounding individual emitters;

a temperature control system for dissipating heat away from the light emitters;

the light emitters being coupled to a common controller; and

further comprising a fixture for holding a work object, the fixture arranged relative to the light module so that a work object may be exposed to light from the module to effect a curing or inspection of the work object with a predetermined wavelength of light for effecting the curing or inspection.

7. The light module of claim 6, wherein the fixture provides fluid flow over the work object during light exposure, and the light module'"'"'s emitters comprise emitters for emitting in the UV bandwidth.

8. A plurality of light modules, each light module comprising:

an array of solid-state light emitters mounted on or formed in a thermally transmissive substrate providing electrical circuit patterns for coupling with the solid-state emitters, the substrate comprising a ceramic or semiconductor material

wherein the density of light emitters in the array is at least 1 emitter per 6.25 mm²;

a lens array layer disposed over the array of solid-state emitters, the lens array having a plurality of lenses formed therein, each lens being optically coupled to one or more light emitters, the lens array being adjacent to the emitters and the substrate surrounding individual emitters;

a temperature control system for dissipating heat away from the light emitters;

the light emitters being coupled to a common controller; and

wherein the plurality of light modules are arranged in at least one of a line or an array.

9. The light module of claim 8, further comprising motive means that provides for movement relative to a target area along both a y-axis and an x-axis.

10. The light module of claim 8 wherein the lens array layer comprises a gel material.