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Method and arrangement for correcting thermally-induced field deformations of a lithographically exposed substrate

  • US 7,462,429 B2
  • Filed: 10/12/2005
  • Issued: 12/09/2008
  • Est. Priority Date: 10/12/2005
  • Status: Active Grant
First Claim
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1. A method for correcting thermally-induced field deformations of a lithographically exposed substrate comprising:

  • providing a model to predict thermally-induced field deformation information of a plurality of fields of said substrate;

    modifying pre-specified exposure information used to configure an exposure of said fields based on said thermally-induced deformation information as predicted by said model;

    exposing a pattern onto said fields in accordance with said pre-specified exposure information as modified;

    wherein predicting thermally-induced field deformation information by said model includes predicting of deformation effects of selected points on said substrate based on at least;

    a time-decaying characteristic as energy is transported across said substrate; and

    a distance between said selected points and an edge of said substrate.

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