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LED bonding structures and methods of fabricating LED bonding structures

  • US 7,462,861 B2
  • Filed: 04/26/2005
  • Issued: 12/09/2008
  • Est. Priority Date: 04/28/2004
  • Status: Active Grant
First Claim
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1. An LED chip comprising:

  • a conductive submount (24);

    a bond pad (31) having a total volume less than 3×

    10

    5
    mm3 conductively joined to said submount;

    a first ohmic contact (18) on said bond pad opposite from said submount;

    an epitaxial region (12) comprising at least a p-type layer (16) and an n-type layer (14);

    a conductive substrate (10) on said epitaxial region opposite said first ohmic contact; and

    an electrode 22 to said conductive substrate opposite from said epitaxial region.

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