Power inverter

• US 7,463,489 B2
• Filed: 04/19/2007
• Issued: 12/09/2008
• Est. Priority Date: 04/22/2006
• Status: Active Grant

• Current Assignee: SMA Solar Technology AG
• Original Assignee: SMA Solar Technology AG
• Inventors: Falk, Andreas, Yasat, Nafiz
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/788,341
• Publication Number:
  US 20070247823A1
• Time in Patent Office: 600 Days
• Field of Search: None
• US Class Current: 361/719
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

The object of the invention is a power inverter, the bottom of the housing (1) of the power inverter being configured to be stepped, cooling bodies (10, 11) being disposed on the exterior face of the stepped bottom, at least two printed circuit boards (6, 8) that overlap each other and communicate with the respective one of the cooling bodies (10, 11) through semiconductor components being provided.

Claims

1. A power inverter, comprising a housing having a bottom, said bottom of the housing of the power inverter being configured to be stepped, cooling bodies being disposed on the exterior face of the stepped bottom, at least two printed circuit boards that overlap each other and communicate with the respective one of the cooling bodies through semiconductor components being provided.

2. The power inverter as set forth in claim 1, wherein said cooling bodies have a desired height and, wherein height of the cooling bodies for mounting to the stepped bottom is selected so that the cooling bodies form a plane when mounted to the housing.

3. The power inverter as set forth in claim 1, wherein the cooling bodies are arranged laterally offset in the housing when viewed from the front.

4. The power inverter as set forth in claim 1, wherein the printed circuit boards communicate with a respective one of the cooling bodies through semiconductor components.

5. The power inverter as set forth in claim 1, wherein magnetic components are provided which are also cooled by the air flowing through the cooling bodies.

6. The power inverter as set forth in claim 1, wherein the cooling bodies comprise means for fastening to a housing part.

7. The power inverter as set forth in claim 6, wherein the housing comprises a connection region for the cable supply.

8. The power inverter as set forth in claim 7, wherein the connection region comprises at least one pole block with a plurality of terminals.

9. The power inverter as set forth in claim 7, wherein cable passageways are provided and transition is provided from the connection chamber to the housing and is sealed with rubber collars in the region of the cable passageways.

10. The power inverter as set forth in claim 7, wherein the connection region comprises a wall oriented at an incline and has a sealable opening for the cables.