Method enabling a standard CMOS fab to produce an IC to sense three-dimensional information using augmented rules creating mask patterns not otherwise expressible with existing fab rules

• US 7,464,351 B2
• Filed: 12/30/2004
• Issued: 12/09/2008
• Est. Priority Date: 11/09/2000
• Status: Expired due to Fees

• Current Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Original Assignee: Canesta Incorporated (Microsoft Corporation)
• Inventors: Bamji, Cyrus, Liu, Xinqiao
• Primary Examiner(s): Dinh; Paul
• Application Number:
  US11/028,290
• Publication Number:
  US 20050156121A1
• Time in Patent Office: 1,440 Days
• Field of Search: 716 4- 5, 716 19- 21, 716/2, 430/5
• US Class Current: 716/50
• CPC Class Codes: G01C 3/00 Measuring distances in line of sight; Optical rangefinders tapes, chains or wheels for measuring length G01B3/00; active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves, G01S17/48
• CPC Class Codes: G01J 3/50 using electric radiation detectors
• CPC Class Codes: G01S 17/36 with phase comparison between the received signal and the contemporaneously transmitted signal
• CPC Class Codes: G01S 17/894 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
• CPC Class Codes: G01S 7/4914 of detector arrays, e.g. charge-transfer gates
• CPC Class Codes: G01S 7/493 Extracting wanted echo signals
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 31/02024 Position sensitive and lateral effect photodetectors; Quadrant photodiodes
• CPC Class Codes: H01L 31/1133 the device being a conductor-insulator-semiconductor diode or a CCD device

Abstract

CMOS implementable three-dimensional silicon sensors are fabricated using a standard fab but using augmented rules that create mask patterns not expressible with existing fab rules. Standard fab rules are not optimized to produce high quality three-dimensional silicon sensors. Accordingly, the normal set of rules does not permit creating the fab mask patterns necessary for high performance such sensors. However, the present invention can use the fab standard mask set with a rich set of fab instructions to express mask patterns from the mask set that would not otherwise be expressible. The resultant method enables high quality silicon sensors for three-dimensional sensing to be readily mass produced from a standard fab.

Claims

1. A method for use with a CMOS fab that provides a set of rules and a set of drawn layers in an existing relationship that defines a set of expressible mask patterns used to create an integrated circuit (IC) structure, the method enabling fabrication by said CMOS fab of an IC sensor structure whose fabrication by said CMOS fab requires mask patterns not expressible using the provided said set of rules and said set of drawn layers in said existing relationship, the method comprising the following steps:

(a) using at least one layer in said set of drawn layers in fabricating said IC sensor structure;

(b) modifying at least one rule in the provided said set of rules to modify said existing relationship provided by said CMOS fab;

(c) using at least one rule modified at step (b) to express at least one mask pattern for said IC sensor structure not expressible otherwise within said existing relationship provided by said CMOS fab; and

(d) using step (a), step (b), and step (c), fabricating said IC sensor structure in said CMOS fab;

wherein said method enables said CMOS fab to produce said IC sensor structure with at least one sensor characteristic superior to that of an IC produced by said CMOS fab without using said method.

2. The method of claim 1, wherein at step (a) said at least one layer defines at least one dopant blocking region.

3. The method of claim 2, wherein during fabrication of said IC sensor structure by said CMOS fab, said at least one dopant blocking region blocks at least one of (i) p-well dopant formation, (ii) n-well dopant formation, (iii) n+ dopant formation, (iv) p+ dopant formation, (v) Vtn dopant formation, and (vi) NLDD dopant formation.

4. The method of claim 1, wherein at step (a) said at least one layer defines at least one of a salicide blocking region, and a polycide blocking region.

5. The method of claim 1, wherein at step (a) said at least one layer defines at least one blocking region.

6. The method of claim 5, wherein said at least one blocking region does at least one of (i) blocking formation of an STI region, and (ii) promoting formation of an STI region.

7. The method of claim 1, wherein at step (a) said at least one layer defines at least one dopant introduction region.

8. The method of claim 7, wherein said at least one dopant introduction region includes at least one of (i) p-well dopant formation, (ii) n-well dopant formation, (iii) n+ dopant formation, (iv+)(p+ dopant formation), (v) Vtn dopant formation, and (vi) NLDD dopant formation.

9. The method of claim 1, wherein at step (a) said at least one layer defines at least one of (i) a salicide introduction region, and (ii) a polycide introduction region.

10. The method of claim 1, wherein said IC sensor structure is one of (i) a sensor IC, (ii) a three-dimensional sensor IC, and (iii) a time-of-flight sensor IC.

11. The method of claim 1, wherein said IC sensor structure generates charge responsive to detected optical energy and includes at least a gate and an associated drain, and wherein said method improves at least one characteristic of said IC sensor structure selected from a group consisting of (i) enhanced transfer of charge generated within said IC sensor structure, (ii) enhanced depletion layer depth of said IC sensor structure, (iii) enhanced charge transfer between said gate and said associated drain, and (iv) enhanced collection of charge generated within said IC sensor structure, and (v) increasing number of detection-generated photoelectrons available for collection by said IC sensor structure.

12. The method of claim 1, wherein said IC sensor structure is an imaging IC and said method improves at least one performance characteristic of said IC sensor structure selected from a group consisting of (i) improved optical performance, and (ii) improved electrical performance.