Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
First Claim
1. A method for processing a substrate, comprising:
- depositing a phenyl containing silicon carbide layer on the substrate by reacting a first gas mixture comprising hydrogen, an inert gas, and dimethylphenylsilane in a plasma; and
depositing an oxygen-doped silicon carbide layer on the phenyl containing silicon carbide layer by reacting a second gas mixture comprising trimethylsilane and carbon dioxide.
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Accused Products
Abstract
Methods are provided for depositing a silicon carbide layer having significantly reduced current leakage. The silicon carbide layer may be a barrier layer or part of a barrier bilayer that also includes a barrier layer. Methods for depositing oxygen-doped silicon carbide barrier layers are also provided. The silicon carbide layer may be deposited by reacting a gas mixture comprising an organosilicon compound, an aliphatic hydrocarbon comprising a carbon-carbon double bond or a carbon-carbon triple bond, and optionally, helium in a plasma. Alternatively, the silicon carbide layer may be deposited by reacting a gas mixture comprising hydrogen or argon and an organosilicon compound in a plasma.
68 Citations
12 Claims
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1. A method for processing a substrate, comprising:
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depositing a phenyl containing silicon carbide layer on the substrate by reacting a first gas mixture comprising hydrogen, an inert gas, and dimethylphenylsilane in a plasma; and depositing an oxygen-doped silicon carbide layer on the phenyl containing silicon carbide layer by reacting a second gas mixture comprising trimethylsilane and carbon dioxide. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for processing a substrate, comprising:
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pre-treating the substrate with a hydrogen plasma; depositing a phenyl containing silicon carbide layer on the substrate by reacting a first gas mixture comprising dimethylphenylsilane while applying RF power; and depositing an oxygen-doped silicon carbide layer on the phenyl containing silicon carbide layer by reacting a second gas mixture comprising trimethylsilane and carbon dioxide. - View Dependent Claims (9, 10, 11, 12)
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Specification