Semiconductor device having multiple substrates
First Claim
1. A semiconductor device comprising:
- a first substrate including first, second and third layers; and
a second substrate including fourth to sixth layers;
wherein the first substrate provides an electric device,wherein the second substrate provides a physical quantity sensor,wherein the first layer of the first substrate is a shield for protecting the electric device and the physical quantity sensor,wherein the second layer of the first substrate is an insulation layer so that the first substrate is provided by a silicon-on-insulator substrate,wherein the sixth layer of the second substrate faces the third layer of the first substrate,wherein the physical quantity sensor includes a movable portion, which is provided by the sixth layer of the second substrate so that the movable portion is sandwiched by the first and second substrates,wherein the second substrate further includes a second loop layer, which surrounds the movable portion, andwherein the second loop layer is electrically connected to the third layer of the first substrate with a loop bump so that the movable portion is shielded.
0 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device includes a first substrate including first, second and third layers; a second substrate; and a loop bump. The first and second substrates provides an electric device and physical quantity sensor. The first layer is a shield for protecting the electric device and physical quantity sensor. The physical quantity sensor includes a movable portion surrounded by a first loop layer of the third layer. The loop bump is disposed between the first and second substrates and surrounds the movable portion, and is electrically coupled with the first loop layer so that the loop bump, first loop layer, first layer and second substrate shield the electric device and physical quantity sensor. The first substrate includes inner and outer pads which are electrically coupled through a wire layer which is electrically insulated from the loop bump, so that a signal from the movable portion is output to and external circuit.
-
Citations
25 Claims
-
1. A semiconductor device comprising:
-
a first substrate including first, second and third layers; and a second substrate including fourth to sixth layers; wherein the first substrate provides an electric device, wherein the second substrate provides a physical quantity sensor, wherein the first layer of the first substrate is a shield for protecting the electric device and the physical quantity sensor, wherein the second layer of the first substrate is an insulation layer so that the first substrate is provided by a silicon-on-insulator substrate, wherein the sixth layer of the second substrate faces the third layer of the first substrate, wherein the physical quantity sensor includes a movable portion, which is provided by the sixth layer of the second substrate so that the movable portion is sandwiched by the first and second substrates, wherein the second substrate further includes a second loop layer, which surrounds the movable portion, and wherein the second loop layer is electrically connected to the third layer of the first substrate with a loop bump so that the movable portion is shielded. - View Dependent Claims (2)
-
-
3. A semiconductor device comprising:
-
a first substrate including first, second and third layers; a second substrate includes fourth to sixth layers; and a bump, wherein the first substrate provides an electric device, wherein the second substrate provides a physical quantity sensor, wherein the first layer of the first sub state is a shield for protecting the electric device and the physical quantity sensor, wherein the electric device is disposed in the third layer of the first substrate, wherein the physical quantity sensor is disposed in the sixth layer of the second substrate, wherein the second layer of the first substrate is made of an insulation layer so that the first substrate is provided by a silicon-on-insulator substrate, wherein the physical quantity sensor includes a movable portion, which is provided by the sixth layer of the second substrate so that the movable portion is sandwiched by the first and second substrates, wherein the movable portion is movable in accordance with a physical quantity applied to the device so that the physical quantity sensor outputs a signal corresponding to a displacement of the movable portion, wherein the first substrate faces the second substrate so that the electric device electrically connects to the physical quantity sensor, wherein the bump is disposed between the third layer of the first substrate and the sixth layer of the second substrate, wherein the first layer of the first substrate and the fourth layer of the second substrate are disposed outside, the fourth layer of the second substrate being apposite to the physical quantity sensor, wherein the sixth layer of the second substrate faces the third layer of the first substrate so that the first substrate is electrically connected to the second substrate through the bump, wherein the second substrate further includes a second loop layer, which surrounds the movable portion, and wherein the second loop layer is electrically connected to the third layer of the first substrate with a loop bump so that the movable portion is shielded. - View Dependent Claims (4)
-
-
5. A semiconductor device comprising:
-
a first substrate including first, second and third layers; a second substrate; and a loop bump, wherein the first substrate provides one of an electric device and a physical quantity sensor, wherein the second substrate provides the other one of the electric device and the physical quantity sensor, wherein the first layer of the first substrate is a shield for protecting the electric device and the physical quantity sensor, wherein the physical quantity sensor includes a movable portion, wherein the third layer of the first substrate includes a first loop layer, which surrounds the movable portion, wherein the loop bump is disposed between the first and second substrates, and surrounds the movable portion, wherein the loop bump is electrically coupled with the first loop layer so that the loop bump, the first loop layer, the first layer and the second substrate shield the electric device and the physical quantity sensor, wherein the first substrate further includes and inner pad, and outer pad, and wire layer, wherein the inner pad is disposed inside of the first loop layer, and the outer pad is disposed outside of the first loop layer, wherein the inner pad is electrically coupled with the outer pad through the wire layer so that a signal from the movable portion is output to and external circuit, and wherein the wire layer is electrically insulated from the loop bump with an insulation film. - View Dependent Claims (6, 7, 8, 9, 10, 11, 13, 14)
-
-
12. A semiconductor device comprising:
-
a first substrate including first, second and third layers; a second substrate; a loop bump; and a bump, wherein the first substrate provides one of an electric device and a physical quantity sensor, wherein the second substrate provides the other one of the electric device and the physical quantity sensor, wherein the first layer of the first substrate is a shield for protecting the electric device and the physical quantity sensor, wherein the one of the electric device and the physical quantity sensor is disposed in the third layer of the first substrate, wherein the other one of the electric device and the physical quantity sensor is disposed in one side of the second substrate, wherein the second layer of the first substrate is made of an insulation layer so that the first and third layers are electrically isolated, wherein the physical quantity sensor includes a movable portion, wherein the movable portion is movable in accordance with a physical quantity applied to the device so that the physical quantity sensor outputs a signal corresponding to a displacement of the movable portion, wherein the first substrate faces the second substrate so that the electric device electrically connects to the physical quantity sensor, wherein the bump is disposed between the third layer of the first substrate and the one side of the second substrate, wherein the third layer of the first substrate faces the second substrate so that the first substrate is electrically connected to the second substrate through the bump, wherein the first layer of the first substrate and the other side of the second substrate are disposed outside the other side of the second substrate being opposite to the other one of the electric device and the physical quantity sensor, wherein the third layer of the first substrate includes a first loop layer, which surrounds the movable portion, wherein the loop bump is disposed between the first and second substrates, and surrounds the movable portion, wherein the loop bump is electrically coupled with the first loop layer so that the loop bump, the first loop layer, the first layer and the second substrate shield the electric device and the physical quantity sensor, wherein the first substrate further includes an inner pad, an outer pad and a wire layer, wherein the inner pad is disposed inside of the first loop layer, and the outer pad is disposed outside of the first loop layer, wherein the inner pad is electrically coupled with the outer pad through the wire layer so that the signal from the movable portion is output to an external circuit, and wherein the wire layer is electrically insulated from the loop bump with an insulation film. - View Dependent Claims (15, 16)
-
-
17. A semiconductor device comprising:
-
a first substrate including first, second and third layers; a second substrate; and a loop bump, wherein the first substrate provides one of an electric device and a physical quantity sensor, wherein the second substrate provides the other one of the electric device and the physical quantity sensor, wherein the first layer of the first substrate is a shield for protecting the electric device and the physical quantity sensor, wherein the physical quantity sensor includes a movable portion, wherein the loop bump is disposed between the first and second substrates, and surrounds the movable portion, wherein the first substrate further includes an inner pad, an outer pad and a wire layer, wherein the inner pad is disposed inside of the loop bump, and the outer pad is disposed outside of the loop bump, wherein the inner pad is electrically coupled with the outer pad through the wire layer, and wherein the wire layer is electrically insulated from the loop bump with an insulation film. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
-
Specification