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Solid state microwave power amplifier

  • US 7,466,203 B2
  • Filed: 06/06/2006
  • Issued: 12/16/2008
  • Est. Priority Date: 06/06/2006
  • Status: Active Grant
First Claim
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1. An RF power amplifier, comprising:

  • an RF input connection;

    an RF output connection;

    at least three sub-amplifier modules;

    a plurality of input electrical paths connecting each of the sub-amplifier modules to the input connection, wherein at least a portion of each of the plurality of input electrical paths collectively and substantially define an input path plane; and

    a plurality of output electrical paths connecting each of the sub-amplifier modules to the output connection, wherein at least a portion of each of the plurality of output electrical paths collectively and substantially define an output path plane, and wherein the electrical paths of at least one of the plurality of input electrical paths and the plurality of output electrical paths are substantially identical, and at least one of the input connection and the output connection is substantially parallel to at least one of the input path plane and the output path plane;

    at least two sub-amplifier substrates defining at least two different planes, wherein at least one sub-amplifier is mounted on each sub-amplifier substrate;

    a power substrate defining a plane different than any of the planes defined by the sub-amplifier substrates, wherein the power substrate comprises electrical connectors configured to connect the sub-amplifier modules to a power source, and wherein the sub-amplifier substrates and the power substrate are connected to one another so as to form a housing comprising a central cavity; and

    sequencing circuitry positioned within the cavity, wherein the sequencing circuitry is configured to control a sequence of applied power signals to one or more of the sub-amplifier modules.

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