Miniature package for translation of sensor sense axis

• US 7,467,552 B2
• Filed: 11/10/2005
• Issued: 12/23/2008
• Est. Priority Date: 11/10/2005
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: MacGugan, Douglas C.
• Primary Examiner(s): Williams; Hezron
• Assistant Examiner(s): FITZGERALD, JOHN P
• Application Number:
  US11/272,154
• Publication Number:
  US 20070101812A1
• Time in Patent Office: 1,139 Days
• Field of Search: 738/665, 734/93
• US Class Current: 73/493
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A ceramic L-shaped or T-shaped packaging apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor die that translates the sensor sense axis perpendicular to the normal input plane for direct attachment to a system-level printed circuit board (PCB).

Claims

1. An apparatus for orthogonally translating an input axis of a Micro Electro-Mechanical System (MEMS) sensor, the apparatus comprising:

a bracket having a bracket body and a bracket leg extending therefrom, the bracket body and bracket leg forming respective first and second substantially planar and mutually orthogonal surfaces;

the first orthogonal surfaces formed by the bracket body further comprises a MEMS sensor die attach surface plane structured for attaching a MEMS sensor die;

the second orthogonal surface formed by the bracket leg further comprises a plurality of electrical interface contacts structured for interfacing with a host structure that is to be monitored; and

a plurality of electrical signal carriers communicating between a portion of the bracket body adjacent to the MEMS sensor mounting surface and the plurality of electrical interface contacts positioned on the interfacing surface of the bracket leg,

wherein the bracket leg forms one of an offset T-shape and an L-shape with the bracket body.

2. The apparatus of claim 1, further comprising a plurality of electrical interface contacts adjacent to die attach surface plane, the electrical interface contacts communicating with the electrical signal carriers.

3. The apparatus of claim 2 wherein the electrical interface contacts further comprise electrical interface contacts selected from the group of electrical interface contacts consisting of:

wire-bond contacts, solder ball contacts, and flip-chip contacts.

4. The apparatus of claim 1 wherein the bracket body further comprises a recessed die cavity.

5. The apparatus of claim 4 wherein the die cavity is further hermetically sealed.

6. The apparatus of claim 5 wherein the interface surface of bracket leg is further offset relative to a base surface of the bracket body.

7. The apparatus of claim 5, further comprising a single MEMS inertial sensor die mounted on the die attach surface plane and electrically interfaced with the electrical signal carriers.

8. The apparatus of claim 4 wherein the bracket body further comprises a plurality of electrical interface contacts adjacent to the recessed die cavity, the electrical signal carriers are in electrical communication with the electrical interface contacts adjacent to the recessed die cavity and the electrical interface contacts positioned on the interfacing surface of the bracket leg.

9. The apparatus of claim 8 wherein the plurality of electrical interface contacts further comprises a plurality of flip-chip electrical interface contacts formed on the MEMS sensor die attach surface plane.

10. The apparatus of claim 8, further comprising a right angle formed between the bracket body and bracket leg.

11. The apparatus of claim 8 wherein the plurality of electrical interface contacts further comprises a plurality of wire-bond contacts adjacent to the recessed die cavity.

12. The apparatus of claim 11 wherein the bracket body further comprises a shelf structure adjacent to and raised relative to the recessed die cavity, the plurality of wire-bond contacts being deposited on the shelf structure.