Method for preventing a metal corrosion in a semiconductor device
First Claim
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1. A method for preventing metal corrosion in a semiconductor or integrated circuit, comprising the steps of:
- forming an oxide layer on a substrate;
forming a metal layer on the oxide layer;
etching the metal layer in a chamber to expose a surface of the oxide layer, the metal layer having a photoresist pattern thereon or thereover;
oxidizing lateral surfaces of the metal layer using a plasma comprising N2O in the chamber to form lateral metal oxides;
removing simultaneously a portion of the oxide layer exposed by etching the metal layer and vertically exposed portions of said lateral metal oxides by sputter etching with an inert gas in the chamber, andremoving the photoresist.
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Abstract
The present invention relates to a method for preventing a metal corrosion in a semiconductor device. The present method includes the steps of etching of a metal layer in a chamber, the metal layer having a photoresist pattern thereon or thereover; oxidizing a surface of the metal layer using a plasma comprising N2O in the same chamber; and removing the photoresist. Therefore, metal corrosion as well as bridges between metal wirings can be suppressed or prevented, thereby improving the profile of metal layer and the reliability and yield of the semiconductor device.
179 Citations
19 Claims
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1. A method for preventing metal corrosion in a semiconductor or integrated circuit, comprising the steps of:
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forming an oxide layer on a substrate; forming a metal layer on the oxide layer; etching the metal layer in a chamber to expose a surface of the oxide layer, the metal layer having a photoresist pattern thereon or thereover; oxidizing lateral surfaces of the metal layer using a plasma comprising N2O in the chamber to form lateral metal oxides; removing simultaneously a portion of the oxide layer exposed by etching the metal layer and vertically exposed portions of said lateral metal oxides by sputter etching with an inert gas in the chamber, and removing the photoresist. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification