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Silicon mirrors having reduced hinge stress from temperature variations

  • US 7,468,826 B2
  • Filed: 05/03/2002
  • Issued: 12/23/2008
  • Est. Priority Date: 05/03/2002
  • Status: Active Grant
First Claim
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1. A torsional hinge apparatus having minimal hinge stress due to temperature variations comprising:

  • a support substrate having a first coefficient of expansion;

    an integral torsional hinge device formed from a material having a different coefficient of expansion, and having an inside portion attached to a support portion along an axis by at least one pair of torsional hinges; and

    anchor means for attaching said support portion of said integral torsional hinge device to said support substrate to allow substantially unrestricted expansion and contraction along two dimensions of said integral torsional hinge device and to disallow movement with respect to said support substrate in a third dimension said anchor means consisting of a single anchor attaching said support portion of said integral torsional hinge device to said support substrate at a single location; and

    a biasing member attached to said support substrate and applying a force against said support portion of said integral torsional hinge device in said third direction another location spaced from said single location.

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