Plasma processing device
First Claim
Patent Images
1. A plasma processing apparatus comprising:
- a chamber for carrying out plasma processing inside;
a dielectric plate for sealing the upper side of said chamber; and
a high frequency supplying unit for supplying high frequency waves into said chamber via said dielectric plate,wherein wave reflecting means for reflecting high frequency waves that propagate inside said dielectric plate is provided in a recess in the dielectric plate or wholly inside the dielectric plate within a region where high frequency waves transmit toward an interior space of said chamber.
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Abstract
A plasma processing apparatus includes a chamber for carrying out plasma processing inside, a top plate made of a dielectric material for sealing the upper side of this chamber, and an antenna section that serves as a high frequency supply for supplying high frequency waves into the chamber via this top plate. The top plate is provided with reflecting members inside thereof. The sidewalls of the reflecting members work as a wave reflector for reflecting high frequency waves that propagate inside the top plate in the radius direction. Alternatively, no reflecting members may be provided in a manner in which the sidewalls of a recess of the top plate serve as a wave reflector.
31 Citations
42 Claims
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1. A plasma processing apparatus comprising:
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a chamber for carrying out plasma processing inside; a dielectric plate for sealing the upper side of said chamber; and a high frequency supplying unit for supplying high frequency waves into said chamber via said dielectric plate, wherein wave reflecting means for reflecting high frequency waves that propagate inside said dielectric plate is provided in a recess in the dielectric plate or wholly inside the dielectric plate within a region where high frequency waves transmit toward an interior space of said chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A plasma processing apparatus comprising:
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a chamber for carrying out plasma processing inside; a dielectric plate for sealing the upper side of said chamber; a high frequency supplying unit for supplying high frequency waves into said chamber via said dielectric plate; and an antenna unit arranged on said dielectric plate, wherein said dielectric plate has a surface having a recess configured to reflect high frequency waves that propagate inside said dielectric plate, said recess being provided within a region where high frequency waves transmit toward an interior space of said chamber. - View Dependent Claims (22, 23, 24, 25, 26)
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27. A plasma processing apparatus comprising:
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a chamber for carrying out plasma processing inside; a dielectric plate for sealing the upper side of said chamber; and a high frequency supplying unit for supplying high frequency waves into said chamber via said dielectric plate, wherein said dielectric plate has a recess in at least one of front and rear surfaces thereof, said dielectric plate has wave reflecting means for reflecting high frequency waves that propagate inside said dielectric plate, said wave reflecting means being provided in the recess or wholly inside the dielectric plate within a region where high frequency waves transmit toward an interior space of said chamber, and said recess provides said dielectric plate with a reduced thickness of no greater than ½
of the wavelength of said high frequency waves when propagating through said dielectric plate. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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Specification