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Chamber isolation valve RF grounding

  • US 7,469,715 B2
  • Filed: 07/01/2005
  • Issued: 12/30/2008
  • Est. Priority Date: 07/01/2005
  • Status: Active Grant
First Claim
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1. A method of grounding a chamber isolation valve for a plasma processing system during plasma processing of substrates, wherein the chamber isolation valve contains a door and a vacuum seal, comprising:

  • moving the door to a position adjacent a first opening in a first chamber and an opposing second opening in a second chambercompressing the vacuum seal between the second opening and the door; and

    establishing electrical contact between the door and at least one electrically grounded component of the plasma processing system using at least one electrically conductive member disposed between the door and the second opening.

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