Vehicle lamp assembly with heat sink

• US 7,470,049 B2
• Filed: 04/23/2007
• Issued: 12/30/2008
• Est. Priority Date: 08/31/2001
• Status: Expired due to Fees

• Current Assignee: Gentex Corporation
• Original Assignee: Gentex Corporation
• Inventors: Roberts, John K., Tuttle, Darin D., Ypma, Kenton J., Steel, Robert, Bostwick, Daniel J., Miskelley, Steven J., Walser, Jeremy A.
• Primary Examiner(s): Sawhney; Hargobind S
• Application Number:
  US11/738,556
• Publication Number:
  US 20070285937A1
• Time in Patent Office: 617 Days
• Field of Search: 362/494, 362/240, 362/294, 362/373, 362545-547, 362/800
• US Class Current: 362/494
• CPC Class Codes: B60Q 1/2665 on rear-view mirrors lighting devices for vehicle interior on or for rear-view mirrors B60Q3/258
• CPC Class Codes: B60Q 3/258 Rear-view mirrors
• CPC Class Codes: B60Q 3/76 for spotlighting, e.g. reading lamps spotlighting on or for specific fittings B60Q3/20; spotlighting in mass transit vehicles B60Q3/44
• CPC Class Codes: B60Q 3/80 Circuits; Control arrangements for dashboards B60Q3/16; for mass transit vehicles B60Q3/47
• CPC Class Codes: B60R 1/1207 with lamps; with turn indicators
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 45/48 with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An apparatus including at least one LED mounted to a printed circuit board, a reflector including at least one heat stake, and a mounting plate comprising at least one aperture for receiving the at least one heat stake. The at least one LED is positioned between the reflector and the mounting plate such that the at least one LED is held in position when the at least one heat stake is received within the at least one aperture.

Claims

1. An interior rearview mirror assembly for a vehicle comprising:

a mirror mounting structure for attaching to the vehicle;

a mirror housing;

a mirror supported by said mirror mounting structure and mounted in said mirror housing; and

a light subassembly supported by said mirror mounting structure within said mirror housing, said light subassembly comprising;

at least one LED device; and

a thermally conductive mounting plate disposed in thermal communication with said at least one LED device, wherein said mounting plate is in direct contact with said mirror mounting structure.

2. The interior rearview mirror assembly of claim 1, wherein said mounting plate comprises a post and said mounting structure comprises an aperture for receiving said post to mount said mounting plate to said mirror mounting structure.

3. The interior rearview mirror assembly of claim 1, wherein said mirror mounting structure comprises a post and said mounting plate comprises at least one aperture for receiving said post.

4. The interior rearview mirror assembly of claim 1, wherein said mirror mounting structure comprises a plurality of posts and said mounting plate comprises a plurality of apertures corresponding to said posts for receiving said posts.

5. The interior rearview mirror assembly of claim 1, wherein said at least one LED device comprises at least one LED chip and a heat extraction element in thermal communication with said at least one LED chip;

and wherein said light subassembly further comprises a thermally conductive reflector for reflecting light emitted by said at least one LED device, said thermally conductive reflector being disposed in thermal communication with said heat extraction element so as to function as a heat sink for said at least one LED chip.

6. An interior rearview mirror assembly for a vehicle comprising:

a mirror mounting structure having a mounting shoe for attaching to the vehicle and having a mounting washer at an end opposite said mounting shoe;

a mirror housing;

a mirror supported by said mirror mounting structure and mounted in said mirror housing; and

a light subassembly supported by said mirror mounting structure within said mirror housing, said light subassembly comprising;

a plurality of LED devices mounted to a circuit board; and

a thermally conductive mounting plate disposed in thermal communication with said at least one LED device, wherein said mounting plate being in direct contact with said mounting washer.

7. The interior rearview mirror assembly of claim 6, wherein said mounting plate comprises a post and said mounting washer comprises an aperture for receiving said post to mount said mounting plate to said mirror mounting structure.

8. The interior rearview mirror assembly of claim 6, wherein said mirror mounting washer comprises a post and said mounting plate comprises at least one aperture for receiving said post.

9. The interior rearview mirror assembly of claim 6, wherein said mirror mounting washer comprises a plurality of posts and said mounting plate comprises a plurality of apertures corresponding to said posts for receiving said posts.

10. The interior rearview mirror assembly of claim 6 and further comprising a reflector for reflecting light emitted by said at least one LED device, said thermally conductive reflector being disposed in thermal communication said at least one LED device.

11. The interior rearview mirror assembly of claim 6, wherein said at least one LED device comprises at least one LED chip and a heat extraction element in thermal communication with said at least one LED chip;

and wherein said light subassembly further comprises a thermally conductive reflector for reflecting light emitted by said at least one LED device, said thermally conductive reflector being disposed in thermal communication with said heat extraction element so as to function as a heat sink for said at least one LED chip.