Multi-substrate package assembly

• US 7,470,894 B2
• Filed: 05/15/2006
• Issued: 12/30/2008
• Est. Priority Date: 03/18/2002
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Cole, Barrett E., Higashi, Robert E., Zins, Christopher J., Krishnankutty, Subash
• Primary Examiner(s): Yam; Stephen
• Application Number:
  US11/383,380
• Publication Number:
  US 20060261252A1
• Time in Patent Office: 960 Days
• Field of Search: 250/239, 250/216, 250/214.1, 257/431, 257/432, 257/434, 257/685, 257/686
• US Class Current: 250/239
• CPC Class Codes: G01J 3/02 Details
• CPC Class Codes: G01J 3/0256 Compact construction
• CPC Class Codes: G01J 3/26 using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors
• CPC Class Codes: H01L 31/105 the potential barrier being of the PIN type
• CPC Class Codes: H01L 31/109 the potential barrier being of the PN heterojunction type

Abstract

A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.

Claims

1. A spectrally tunable detector assembly for receiving incoming light along an optical axis, comprising:

a first substrate having a number of bond pads and a tunable bandpass filter;

a second substrate having a number of bond pads and a detector;

a package having a cavity and a number of external terminals; and

the first substrate and the second substrate both mounted in the cavity of the package along the optical axis with the first substrate positioned upstream of the second substrate, with selected bond pads of the first substrate and/or selected bond pads of the second substrate electrically connected to selected terminals of the package;

wherein the tunable bandpass filter is provided on or adjacent to a first side of the first substrate, and the detector is provided on or adjacent a first side of the second substrate, wherein the first side of the first substrate faces away from the first side of the second substrate along the optical axis when the first substrate and the second substrate are mounted in the cavity of the package.

2. A spectrally tunable detector assembly according to claim 1 further comprising a third substrate having a number of bond pads and further having a readout support circuit, wherein the third substrate is also mounted in the cavity of the package.

3. A spectrally tunable detector assembly according to claim 1 wherein the first substrate is fixed relative to the second substrate.

4. A spectrally tunable detector assembly according to claim 3 wherein the first substrate is physically attached to the second substrate.

5. A spectrally tunable detector assembly according to claim 1 wherein the package includes a ledge around a periphery of the cavity, wherein at least some of the terminals of the package are electrically connected to one or more bond pads positioned along the ledge of the package.

6. A spectrally tunable detector assembly according to claim 2 wherein the cavity includes a right side, a left side, a top side and a bottom side, and further includes one or more bond pads that are electrically connected to at least some of the terminals of the package, selected bond pads of the third substrate are electrically connected to selected bond pads of the package along the right and/or left sides of the cavity, and selected bond pads of the first substrate are electrically connected to selected bond pads of the package along the top and/or bottom sides of the cavity.

7. A spectrally tunable detector assembly according to claim 1 wherein the first substrate is substantially transparent to the light that is to be detected by the detector.

8. A spectrally tunable detector assembly according to claim 1 wherein at least one bond pad of the first substrate is electrically connected to at least one terminal of the package.

9. A spectrally tunable detector assembly according to claim 8 wherein the at least one bond pad of the first substrate is wire bonded to at least one terminal of the package.

10. A spectrally tunable detector assembly according to claim 1, further comprising a seal that provides a vacuum seal for at least the tunable bandpass filter.

11. A spectrally tunable detector assembly for receiving incoming light along an optical axis, comprising:

a first substrate having a number of bond pads and further having a tunable bandpass filter;

a second substrate having a number of bond pads and further having a detector;

a third substrate having a number of bond pads and further having a readout support circuit;

a package having a cavity and a number of external terminals;

the first substrate, the second substrate and the third substrate all mounted in the cavity of the package, with selected bond pads of the first substrate, the second substrate and/or the third substrate electrically connected to selected terminals of the package; and

wherein at least the first substrate and the second substrate are mounted along the optical axis with the first substrate positioned upstream of the second substrate.

12. A spectrally tunable detector assembly according to claim 11 wherein at least one bond pad of the first substrate and at least one bond pad of the third substrate are electrically connected to selected terminals of the package.

13. A spectrally tunable detector assembly according to claim 11 further comprising a package frame having a number of bond pads with selected bond pads of the package frame electrically connected to selected bond pads of the first substrate;

the package further including one or more bond pads that are electrically connected to at least some of the terminals of the package;

the third substrate positioned in the cavity of the package, with selected bond pads of the third substrate electrically connected to selected bond pads of the package;

the second substrate positioned in the cavity of the package adjacent the third substrate, with selected bond pads of the second substrate electrically connected to selected bond pads of the package; and

the package frame and first substrate positioned adjacent the detector, with selected bond pads of the package frame and/or first substrate electrically connected to selected bond pads of the package.

14. A spectrally tunable detector assembly according to claim 13 wherein the package includes a first ledge and a second ledge extending around at least part of a periphery of the cavity, with the first ledge being lower than the second ledge, the bond pads of the package being positioned along the first ledge and the second ledge.

15. A spectrally tunable detector assembly according to claim 14 wherein the selected bond pads of the third substrate are electrically connected to selected bond pads on the first ledge of the package.

16. A spectrally tunable detector assembly according to claim 15 wherein the selected bond pads of the second substrate are electrically connected to selected bond pads on the first ledge of the package.

17. A spectrally tunable detector assembly according to claim 15 wherein the selected bond pads of the package frame and/or the first substrate are electrically connected to selected bond pads on the second ledge of the package.

18. A spectrally tunable detector assembly according to claim 13 wherein the package frame and the first substrate are positioned within the cavity.

19. A spectrally tunable detector assembly according to claim 18 wherein the cavity is adapted to receive the package frame and the first substrate.