LED packaging

• US 7,470,935 B2
• Filed: 11/07/2005
• Issued: 12/30/2008
• Est. Priority Date: 11/07/2005
• Status: Active Grant

• Current Assignee: Taiwan Oasis Technology Co., Ltd.
• Original Assignee: Taiwan Oasis Technology Co., Ltd.
• Inventors: Lee, Ming-Shun, Sung, Ping-Ru
• Primary Examiner(s): Monbleau; Davienne
• Assistant Examiner(s): Trinh; Hoa B
• Application Number:
  US11/267,509
• Publication Number:
  US 20070102717A1
• Time in Patent Office: 1,149 Days
• Field of Search: 257/100, 257/676, 257/79, 257/99, 257/103, 257/98, 257/687, 257/710, 257/789, 257/102, 257/E51.018, 257/E51.022, 313/498, 313/487, 313/486
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.

Claims

1. An LED packaging construction comprising:

a) a substrate having a recessed carrier;

b) a chip embedded in the recessed carrier located in the substrate;

c) a plurality of conduction circuits with different electrodes being located on a periphery of the recessed carrier, an electrode layer of the chip being connected to each of the plurality of conduction circuits with a golden plated wire;

d) a fluorescent powder layer filling the recessed carrier; and

e) a colloid mounted directly on coplanar surfaces of the substrate and the fluorescent powder layer, the colloid being a see through packaging colloid, each golden plated wire extending through the fluorescent powder layer and extending into the packaging colloid above the coplanar surfaces of the substrate and the fluorescent powder layer.

2. The LED packaging construction according to claim 1, wherein the substrate is a plastic sheet.

3. The LED packaging construction according to claim 1, wherein the substrate is a circuit board.

4. The LED packaging construction according to claim 1, further comprising a metal reflection layer plated in the recessed carrier.

5. The LED packaging construction according to claim 1, wherein the fluorescent powder layer contains yellow fluorescent powders.

6. The LED packaging construction according to claim 1, wherein the fluorescent powder layer contains yellow and green fluorescent powders.

7. The LED packaging construction according to claim 1, wherein the packaging colloid has a rectangular shape.

8. The LED packaging construction according to claim 1, wherein the packaging colloid has an exterior having a shape of an arc.

9. The LED packaging construction according to claim 1, wherein the colloid has a periphery larger than a periphery of the recessed carrier.