Ultrasound transducer and method of producing the same
First Claim
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1. An ultrasound transducer comprising:
- a) at least one piezoelectric body (1, 11) with at least a lower and an upper electrode (5),b) a coupling layer comprising at least one wafer (7) on which the ultrasound transducer is connected to the lower electrode,c) conductor structures (9, 12) of uniform conductor height disposed on the wafer below the piezoelectric bodies which are in contact with the lower electrode and disposed in spaced relationship from the wafer surface, andd) the space (10) between the wafer and the piezo electric body at opposite sides of the conductor structure being completely filled with a binding material.
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Abstract
In an ultrasound transducer arrangement comprising at least one piezoelectric body with a lower and an upper electrode and a coupling layer including a wafer on which the ultrasound transducers are disposed and are connected to the lower electrode, a conductor structure of uniform height is disposed on the wafer and is in contact with the lower electrode and any space between the piezoelectric body and the wafer is completely filled with a cement material.
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Citations
9 Claims
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1. An ultrasound transducer comprising:
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a) at least one piezoelectric body (1, 11) with at least a lower and an upper electrode (5), b) a coupling layer comprising at least one wafer (7) on which the ultrasound transducer is connected to the lower electrode, c) conductor structures (9, 12) of uniform conductor height disposed on the wafer below the piezoelectric bodies which are in contact with the lower electrode and disposed in spaced relationship from the wafer surface, and d) the space (10) between the wafer and the piezo electric body at opposite sides of the conductor structure being completely filled with a binding material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification