Ultrasound transducer and method of producing the same

• US 7,471,034 B2
• Filed: 06/15/2006
• Issued: 12/30/2008
• Est. Priority Date: 05/08/2004
• Status: Expired due to Fees

• Current Assignee: Forschungszentrum Karlsruhe Gmbh
• Original Assignee: Forschungszentrum Karlsruhe Gmbh
• Inventors: Schlote-Holubek, Klaus, Gobel, Georg, Stotzka, Rainer
• Primary Examiner(s): Dougherty; Thomas M
• Application Number:
  US11/453,525
• Publication Number:
  US 20060230605A1
• Time in Patent Office: 929 Days
• Field of Search: 310/322, 310/326, 310/327, 310/334, 310/340, 310/345, 310/348, 310/367, 310/368
• US Class Current: 310/348
• CPC Class Codes: A61B 8/4494 characterised by the arrangement of the transducer elements devices for short-range imaging using particular transducer elements arrangements under G01S15/8909; arrangements of transducers in generation of mechanical vibrations of infrasonic, sonic or ultrasonic frequency B06B1/0607
• CPC Class Codes: B06B 1/0607 using multiple elements B06B1/064 and B06B1/0688 take precedence
• CPC Class Codes: B06B 1/0644 using a single piezoelectric element B06B1/0688 takes precedence
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer

Abstract

In an ultrasound transducer arrangement comprising at least one piezoelectric body with a lower and an upper electrode and a coupling layer including a wafer on which the ultrasound transducers are disposed and are connected to the lower electrode, a conductor structure of uniform height is disposed on the wafer and is in contact with the lower electrode and any space between the piezoelectric body and the wafer is completely filled with a cement material.

Claims

1. An ultrasound transducer comprising:

a) at least one piezoelectric body (1, 11) with at least a lower and an upper electrode (5),

b) a coupling layer comprising at least one wafer (7) on which the ultrasound transducer is connected to the lower electrode,

c) conductor structures (9, 12) of uniform conductor height disposed on the wafer below the piezoelectric bodies which are in contact with the lower electrode and disposed in spaced relationship from the wafer surface, and

d) the space (10) between the wafer and the piezo electric body at opposite sides of the conductor structure being completely filled with a binding material.

2. An ultrasound transducer as defined in claim 1, wherein the conductor structure extends only under areas of the piezoelectric body which are acoustically inactive or have little activity.

3. An ultrasound transducer as defined in claim 2, wherein the areas are formed by the edge areas of the piezoelectric body.

4. An ultrasound transducer as defined in claim 1, wherein the wafer has an acoustic impedance which is between that of the piezoelectric body and that of water.

5. An ultrasound transducer as defined in claim 1, wherein the binding material is a cement.

6. An ultrasound transducer as defined in claim 5, wherein the cement includes mixed into it particles of a filler material which influences the acoustic impedance and the attenuation behavior of the cement.

7. An ultrasound transducer as defined in claim 1, wherein the piezoelectric bodies are structured by cavities which extend from the upper electrode but not down to the lower electrode.

8. An ultrasound transducer as defined in claim 7, wherein the cavities extend down from the upper electrode at least 80% of the distance to the lower electrode.

9. An ultrasound transducer as defined in claim 7, wherein the cavities are saw cuts defining thereby columns or strip structures.