Planar mixed-signal circuit board
First Claim
1. A mixed signal circuit board comprising:
- a distribution circuit board;
an RF circuit board disposed upon the distribution circuit board and comprising one or more RF signal paths, wherein the RF circuit board is formed around each RF signal path to provide vertical surfaces adjacent to each RF signal path and along a substantial length of each RF signal path; and
a conductive plating substantially surrounding the one or more RF signal paths including the vertical surfaces.
3 Assignments
0 Petitions
Accused Products
Abstract
A mixed-signal circuit board can provide a flexible arrangement of multiple RF transmission mediums in a single lightweight and compact structure as well as support embedding electronic devices within RF transmission paths. The transmission mediums may include a voided waveguide, a dielectric waveguide, a microstrip, a suspended microstrip, a traditional stripline, and a suspended stripline. The center conductors in each transmission medium may be constructed on the same plane or the same PCB layer in order to simplify coplanar design. A distribution board can be provided to deliver the power supply and control signals to the active electronic devices placed in the signal path of the RF board for signal processing and within covered cavities provided within the RF board.
-
Citations
20 Claims
-
1. A mixed signal circuit board comprising:
-
a distribution circuit board; an RF circuit board disposed upon the distribution circuit board and comprising one or more RF signal paths, wherein the RF circuit board is formed around each RF signal path to provide vertical surfaces adjacent to each RF signal path and along a substantial length of each RF signal path; and a conductive plating substantially surrounding the one or more RF signal paths including the vertical surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An RF circuit board comprising:
-
at least one RF signal path, each comprising an RF transmission line; a plurality of layers of RF circuit board substrate shaped to support the transmission line and an area adjacent to the transmission line; and a conductive plating substantially surrounding each RF signal path. - View Dependent Claims (13, 14, 15)
-
-
16. A process for manufacturing mixed-signal circuit board, comprising the steps of:
-
cutting individual layers of RF circuit board to shape of one or more RF signal paths; laminating the individual layers of RF circuit board together; plating the RF circuit board by substantially encapsulating the RF circuit board in an electrically conductive plating material; and providing device pockets and interconnection apertures within the RF circuit board. - View Dependent Claims (17, 18, 19, 20)
-
Specification