Projection optical system, exposure apparatus, and exposure method

• US 7,471,374 B2
• Filed: 10/28/2005
• Issued: 12/30/2008
• Est. Priority Date: 05/01/2003
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Omura, Yasuhiro, Ikezawa, Hironori, Ishida, Kumiko
• Primary Examiner(s): NGUYEN, HUNG
• Application Number:
  US11/260,160
• Publication Number:
  US 20060087633A1
• Time in Patent Office: 1,159 Days
• Field of Search: 355/30, 355/52, 355/53, 355/55, 355 67- 71, 359/859, 359/861
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70241 Optical aspects of refractive lens systems, i.e. comprising only refractive elements
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70425 Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
• CPC Class Codes: G03F 7/70466 Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature stitching G03F7/70475
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Abstract

A projection optical system and exposure method for forming a reduced image of a first surface on a second surface, including forming a projection exposure of a reduced image of a pattern formed on a mask on a photosensitive substrate, the optical path between the projection optical system and the second surface being filled with a medium having a refractive index larger than 1.1 where a refractive index of an atmosphere in the optical path of the projection optical system is 1, and the magnification of the projection optical system being not more than ⅛. In variations, the projection optical system is substantially telecentric on both the first surface side and the second surface side; every optical member having a power in the projection optical system is a transmitting optical member; and a projection exposure in a one shot-area can include a plurality of partial exposures in partial exposure regions.

Claims

1. A projection optical system for forming a reduced image of a first surface on a second surface, wherein

an optical path between the projection optical system and the second surface is filled with a medium having a refractive index larger than 1.1 where a refractive index of an atmosphere in an optical path of the projection optical system is 1,

every optical member having a power in the projection optical system is a transmitting optical member,

a magnification of the projection optical system is not more than ⅛

, and

the projection optical system is substantially telecentric on both a first surface side and a second surface side of the projection optical system.

2. The projection optical system according to claim 1, satisfying the following condition:

0.18<

L2/LA<

0.245 

 

(1),

where L2 is a distance from a pupil position on the second surface side to the second surface and LA is a distance from the first surface to the second surface.

3. The projection optical system according to claim 2, comprising:

at least one variable aperture stop disposed at or near the pupil position on the second surface side.

4. The projection optical system according to claim 2, comprising the following lens units arranged in order from the first surface side:

a first lens unit having a positive refracting power;

a second lens unit having a negative refracting power;

a third lens unit having a positive refracting power;

a fourth lens unit having a negative refracting power;

a fifth lens unit having a positive refracting power;

an aperture stop; and

a sixth lens unit having a positive refracting power;

wherein, where a size of a region occupied on each optical surface by a beam from a point on an optical axis of the first surface is defined as a partial diameter, the projection optical system satisfies the following condition;

0.04<

P2/PX<

0.2 

 

(2),

where PX is a maximum partial diameter in the projection optical system and P2 is a minimum partial diameter in the second lens unit.

5. The projection optical system according to claim 4, satisfying the following condition:

0.4<

D4/D0<

0.9 

 

(3),

where D4 is a minimum clear aperture radius of a lens in the fourth lens unit and D0 is a clear aperture radius of the first surface.

6. The projection optical system according to claim 2, comprising the following lens units arranged in order from the first surface side:

a first lens unit having a negative refracting power;

a second lens unit having a positive refracting power;

a third lens unit having a negative refracting power;

a fourth lens unit having a positive refracting power;

an aperture stop; and

a fifth lens unit having a positive refracting power;

wherein, where a size of a region occupied on each optical surface by a beam from a point on an optical axis of the first surface is defined as a partial diameter, the projection optical system satisfies the following condition;

0.07<

P3/PX<

0.23 

 

(4),

where PX is a maximum partial diameter in the projection optical system and P3 is a minimum partial diameter in the third lens unit.

7. The projection optical system according to claim 6, satisfying the following condition:

0.35<

D3/D0<

0.85 

 

(5),

where D3 is a minimum clear aperture radius of a lens in the third lens unit and D0 is a clear aperture radius of the first surface.

8. An exposure apparatus comprising:

an illumination system which illuminates a mask set as the first surface; and

the projection optical system as set forth in claim 2, which forms an image of a pattern formed on the mask, on a photosensitive substrate set as the second surface.

9. The exposure apparatus according to claim 8,

wherein the image of the pattern is formed in a portion on the photosensitive substrate in a state in which the mask and the photosensitive substrate are kept still relative to the projection optical system, and wherein at least the photosensitive substrate is moved relative to the projection optical system, in order to form the image of the pattern in another portion different from the portion, in the state in which the mask and the photosensitive substrate are kept still relative to the projection optical system.

10. The exposure apparatus according to claim 9,

wherein the portion and the different portion of a shot-area overlap in part with each other.

11. The projection optical system according to claim 1, comprising the following lens units arranged in order from the first surface side:

a first lens unit having a positive refracting power;

a second lens unit having a negative refracting power;

a third lens unit having a positive refracting power;

a fourth lens unit having a negative refracting power;

a fifth lens unit having a positive refracting power;

an aperture stop; and

a sixth lens unit having a positive refracting power;

wherein, where a size of a region occupied on each optical surface by a beam from a point on an optical axis of the first surface is defined as a partial diameter, the projection optical system satisfies the following condition;

0.04<

P2/PX<

0.2 

 

(2),

where PX is a maximum partial diameter in the projection optical system and P2 is a minimum partial diameter in the second lens unit.

12. The projection optical system according to claim 11, satisfying the following condition:

0.4<

D4/D0<

0.9 

 

(3),

where D4 is a minimum clear aperture radius of a lens in the fourth lens unit and D0 is a clear aperture radius of the first surface.

13. The projection optical system according to claim 12,

wherein the medium contains water.

14. An exposure apparatus comprising:

an illumination system which illuminates a mask set as the first surface; and

the projection optical system as set forth in claim 12, which forms an image of a pattern formed on the mask, on a photosensitive substrate set as the second surface.

15. The exposure apparatus according to claim 14,

wherein the image of the pattern is formed in a portion on the photosensitive substrate in a state in which the mask and the photosensitive substrate are kept still relative to the projection optical system, and wherein at least the photosensitive substrate is moved relative to the projection optical system, in order to form the image of the pattern in another portion different from the portion, in the state in which the mask and the photosensitive substrate are kept still relative to the projection optical system.

16. The exposure apparatus according to claim 15,

wherein the portion and the different portion of a shot-area overlap in part with each other.

17. The projection optical system according to claim 1, comprising the following lens units arranged in order from the first surface side:

a first lens unit having a negative refracting power;

a second lens unit having a positive refracting power;

a third lens unit having a negative refracting power;

a fourth lens unit having a positive refracting power;

an aperture stop; and

a fifth lens unit having a positive refracting power;

wherein, where a size of a region occupied on each optical surface by a beam from a point on an optical axis of the first surface is defined as a partial diameter, the projection optical system satisfies the following condition;

0.07<

P3/PX<

0.23 

 

(4),

where PX is a maximum partial diameter in the projection optical system and P3 is a minimum partial diameter in the third lens unit.

18. The projection optical system according to claim 17, satisfying the following condition:

0.35<

D3/D0<

0.85 

 

(5),

where D3 is a minimum clear aperture radius of a lens in the third lens unit and D0 is a clear aperture radius of the first surface.

19. The projection optical system according to claim 18,

wherein the medium contains water.

20. An exposure apparatus comprising:

an illumination system which illuminates a mask set as the first surface; and

the projection optical system as set forth in claim 18, which forms an image of a pattern formed on the mask, on a photosensitive substrate set as the second surface.

21. The exposure apparatus according to claim 20,

wherein the image of the pattern is formed in a portion on the photosensitive substrate in a state in which the mask and the photosensitive substrate are kept still relative to the projection optical system, and wherein at least the photosensitive substrate is moved relative to the projection optical system, in order to form the image of the pattern in another portion different from the portion, in the state in which the mask and the photosensitive substrate are kept still relative to the projection optical system.

22. The exposure apparatus according to claim 21,

wherein the portion and the different portion of a shot-area overlap in part with each other.

23. An exposure apparatus comprising:

an illumination system which illuminates a mask set as the first surface; and

the projection optical system as set forth in claim 1, which forms an image of a pattern formed on the mask, on a photosensitive substrate set as the second surface.

24. The exposure apparatus according to claim 23,

wherein the image of the pattern is formed in a portion on the photosensitive substrate in a state in which the mask and the photosensitive substrate are kept still relative to the projection optical system, and wherein at least the photosensitive substrate is moved relative to the projection optical system, in order to form the image of the pattern in another portion different from the portion, in the state in which the mask and the photosensitive substrate are kept still relative to the projection optical system.

25. The exposure apparatus according to claim 24,

wherein the portion and the different portion of a shot-area overlap in part with each other.

26. An exposure method comprising:

an illumination step of illuminating a mask set as the first surface; and

an exposure step of effecting a projection exposure of an image of a pattern formed on the mask, onto a photosensitive substrate set as the second surface, through the projection optical system as set forth in claim 1.

27. The exposure method according to claim 26,

wherein the exposure step comprises performing a projection exposure in one shot-area having a plurality of partial exposure regions, and

wherein the exposure step further comprises a plurality of partial exposure steps each of which is to perform a projection exposure in the partial exposure region.

28. The exposure method according to claim 27,

wherein the partial exposure step comprises performing a projection exposure in a partial exposure region having a size of approximately a quarter of the one shot-area, and

wherein the exposure step comprises at least four the partial exposure steps.

29. The exposure method according to claim 27,

wherein the partial exposure step comprises performing a still projection exposure in the partial exposure region in a state in which the mask and the photosensitive substrate are kept still relative to the projection optical system.

30. The exposure method according to claim 27, further comprising:

a mask replacing step of replacing the mask with another between the first partial exposure step and the second partial exposure step in the exposure step.

31. The exposure method according to claim 30,

wherein the exposure step is to perform projection exposures in a plurality of shot-areas, and

wherein the mask replacing step is executed between the first partial exposure step for the plurality of shot-areas and the second partial exposure step for the plurality of shot-areas.

32. An exposure method of effecting a projection exposure of a reduced image of a pattern formed on a mask, through a projection optical system onto a photosensitive substrate, the exposure method comprising:

a preparation step of preparing the projection optical system having a magnification of not more than ⅛

;

a filling step of filling an optical path between the projection optical system and the photosensitive substrate with a medium having a refractive index larger than 1.1, where a refractive index of an atmosphere in an optical path of the projection optical system is 1; and

an exposure step of effecting a projection exposure in one shot-area on the photosensitive substrate,

wherein the exposure step comprises the projection exposure in one shot-area including a plurality of partial exposure regions, and

wherein the exposure step further comprises a plurality of partial exposure steps each of which is to perform a projection exposure in the partial exposure region.

33. The exposure method according to claim 32,

wherein the partial exposure step comprises performing a projection exposure in a partial exposure region having a size of approximately a quarter of the one shot-area, and

wherein the exposure step comprises at least four the partial exposure steps.

34. The exposure method according to claim 33,

wherein the partial exposure step comprises performing a still projection exposure in the partial exposure region in a state in which the mask and the photosensitive substrate are kept still relative to the projection optical system.

35. The exposure method according to claim 34, further comprising:

a mask replacing step of replacing the mask with another between the first partial exposure step and the second partial exposure step of the exposure step.

36. The exposure method according to claim 35,

wherein the exposure step further comprises performing projection exposures in a plurality of shot-areas, and

wherein the mask replacing step is executed between the first partial exposure step for the plurality of shot-areas and the second partial exposure step for the plurality of shot-areas.