Semiconductor transistors with expanded top portions of gates
First Claim
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1. A semiconductor structure fabrication method, comprising:
- providing a structure which comprises;
(a) a substrate which includes a top substrate surface, and a semiconductor region being on the top substrate surface, the semiconductor region including a channel region, a first source/drain region, and a second source/drain region, wherein the channel region is disposed between the first source/drain region and the second source/drain region,wherein the top substrate surface defines a reference direction perpendicular to the top substrate surface,(b) a gate dielectric region in direct physical contact with the channel region, and(c) a gate electrode region including a top portion and a bottom portion,wherein the bottom portion is disposed between the top portion and the gate dielectric region,wherein the bottom portion is in direct physical contact with the gate dielectric region,wherein the gate electrode region is electrically insulated from the channel region by the gate dielectric region, andwherein the gate electrode region is formed by (i) providing a gate electrode layer; and
(ii) patterning the gate electrode layer resulting in the gate electrode region; and
after said providing the structure is performed, implanting atoms in the top portion of the gate electrode region resulting in the top portion of the gate electrode region being expanded in a lateral direction perpendicular to the reference direction, wherein said implanted atoms comprise germanium atoms;
after said implanting the atoms is performed, forming a conformal dielectric layer on top and side walls of the gate electrode region;
after said forming the conformal dielectric layer is performed, forming a dielectric spacer layer on the conformal dielectric layer; and
after said forming the dielectric spacer layer is performed, etching the dielectric spacer layer such that only spacer portions of the dielectric spacer layer which are under the conformal dielectric layer remain, wherein for any point of the remaining spacer portions, a straight line going through that point and being parallel to the reference direction intersects the conformal dielectric layer.
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Abstract
A method for forming a semiconductor transistor with an expanded top portion of a gate The gate is expanded through implanting atoms in the top portion of transistor'"'"'s gate electrode region. The transistor formed includes a semiconductor region having two source/drain regions and a gate dielectric region formed on the channel region between the source/drain regions. The gate electrode region is formed on the gate dielectric region. The gate electrode region is formed such that it is electrically insulated from the channel region by the gate dielectric region. The top of the gate electrode region formed is wider than the bottom of the gate electrode region.
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Citations
16 Claims
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1. A semiconductor structure fabrication method, comprising:
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providing a structure which comprises; (a) a substrate which includes a top substrate surface, and a semiconductor region being on the top substrate surface, the semiconductor region including a channel region, a first source/drain region, and a second source/drain region, wherein the channel region is disposed between the first source/drain region and the second source/drain region, wherein the top substrate surface defines a reference direction perpendicular to the top substrate surface, (b) a gate dielectric region in direct physical contact with the channel region, and (c) a gate electrode region including a top portion and a bottom portion, wherein the bottom portion is disposed between the top portion and the gate dielectric region, wherein the bottom portion is in direct physical contact with the gate dielectric region, wherein the gate electrode region is electrically insulated from the channel region by the gate dielectric region, and wherein the gate electrode region is formed by (i) providing a gate electrode layer; and
(ii) patterning the gate electrode layer resulting in the gate electrode region; andafter said providing the structure is performed, implanting atoms in the top portion of the gate electrode region resulting in the top portion of the gate electrode region being expanded in a lateral direction perpendicular to the reference direction, wherein said implanted atoms comprise germanium atoms; after said implanting the atoms is performed, forming a conformal dielectric layer on top and side walls of the gate electrode region; after said forming the conformal dielectric layer is performed, forming a dielectric spacer layer on the conformal dielectric layer; and after said forming the dielectric spacer layer is performed, etching the dielectric spacer layer such that only spacer portions of the dielectric spacer layer which are under the conformal dielectric layer remain, wherein for any point of the remaining spacer portions, a straight line going through that point and being parallel to the reference direction intersects the conformal dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A semiconductor structure fabrication method, comprising:
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providing a structure which comprises; (a) a substrate which includes a top substrate surface, and a semiconductor region being on the top substrate surface, the semiconductor region including a first portion, a second portion, and a channel region, wherein the channel region is disposed between the first and second portions, wherein the top substrate surface defines a reference direction perpendicular to the top substrate surface, (b) a gate dielectric region in direct physical contact with the channel region, and (c) a gate electrode region including a top portion and a bottom portion, wherein the bottom portion is in direct physical contact with the gate dielectric region, wherein the gate electrode region is electrically insulated from the channel region by the gate dielectric region, and wherein the gate electrode region is formed by (i) providing a gate electrode layer; and
(ii) patterning the gate electrode layer resulting in the gate electrode region; andafter said providing the structure is performed, implanting atoms in the top portion of the gate electrode region so as to expand the top portion of the gate electrode region in a lateral direction perpendicular to the reference direction, wherein said implanted atoms comprise germanium atoms; after said implanting the atoms is performed, forming a conformal dielectric layer on top and side walls of the gate electrode region; after said forming the conformal dielectric layer is performed, forming a dielectric spacer layer on the conformal dielectric layer; and after said forming the dielectric spacer layer is performed, etching the dielectric spacer layer such that only spacer portions of the dielectric spacer layer which are under the conformal dielectric layer remain, wherein for any point of the remaining spacer portions, a straight line going through that point and being parallel to the reference direction intersects the conformal dielectric layer. - View Dependent Claims (15, 16)
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Specification