High power LED package with universal bonding pads and interconnect arrangement

• US 7,473,933 B2
• Filed: 10/26/2005
• Issued: 01/06/2009
• Est. Priority Date: 10/29/2004
• Status: Active Grant

• Current Assignee: LED Engin, Inc. (Ams-Osram AG)
• Original Assignee: Ledengin, Inc. (Ams-Osram AG)
• Inventors: Yan, Xiantao
• Primary Examiner(s): Jackson, Jr.; Jerome
• Assistant Examiner(s): Ho; Anthony
• Application Number:
  US11/259,842
• Publication Number:
  US 20060091416A1
• Time in Patent Office: 1,168 Days
• Field of Search: 257/99, 257/E25.004, 257/E25.019
• US Class Current: 257/88
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

LED packages are provided that can accommodate more than one type of LED. These packages include at least three bonding pads arranged such that two are appropriate for one type of LED, while another two are appropriate for another type of LED. Packages can include a thermally conductive layer on which the bonding pads and associated traces are disposed. The packages can also include electrical contacts on either of their top or bottom surfaces that are electrically coupled to the bonding pads by metallized vias or partial vias defined along edges or corners of the packages. Packages for multiple LEDs are also provided. These packages can enable the LEDs to be selectively operable.

Claims

1. A package for multiple LEDs comprising:

a body including

top and bottom surfaces;

a cavity extending from the top surface towards the bottom surface and having a floor that is substantially parallel to the bottom surface;

a thermally conducting material disposed between the floor and the bottom surface;

a plurality of LED bonding pads disposed on the floor; and

a plurality of electrical bonding pads disposed on the floor proximate to the LED bonding pads and in electrical communication with a plurality of electrical contacts disposed on a surface of the body, the plurality of electrical bonding pads in electrical communication with the plurality of electrical contacts through a plurality of vias and at least one of the plurality of vias consisting of a partial via.

2. The package of claim 1 wherein the thermally conducting material comprises a ceramic.

3. The package of claim 1 wherein the plurality of electrical contacts are disposed on the bottom surface of the body.

4. The package of claim 1 further comprising an ESD protection device coupled between two of the plurality of electrical bonding pads.

5. A package for multiple LED'"'"'s and for attachment to a substrate comprising:

a top body layer;

a cavity disposed through the top body layer and having a floor for bonding to the multiple LED'"'"'s;

a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface, the thermal conduction layer including a thermally conducting ceramic material disposed between the floor and the bottom surface;

a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED'"'"'s; and

a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.

6. The package of claim 5 further comprising a central pad disposed on the bottom surface of the thermal conduction layer and having a continuously curved periphery without a corner.

7. The package of claim 6 wherein at least one of the electrical contacts is in electrical communication with the central pad.

8. The package of claim 5 wherein the plurality of electrical contacts are disposed on the bottom surface of the thermal conduction layer.

9. The package of claim 5 further comprising a luminescent layer disposed over the LED dies and a thermal insulation layer disposed between the luminescent layer and the LED dies.

10. The package of claim 5 further comprising a via configured to provide electrical communication between at least one of electrical bonding pads and at least one of the plurality of electrical contacts wherein the via consists of a partial via.

11. The light emitting device of claim 5 wherein the plurality of LED bonding pads are electrically conductive.