Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

• US 7,473,995 B2
• Filed: 03/25/2002
• Issued: 01/06/2009
• Est. Priority Date: 03/25/2002
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Rumer, Christopher L., Koning, Paul A., Jayaraman, Saikumar, Dani, Ashay, Houle, Sabina J.
• Primary Examiner(s): Whitehead, Jr.; Carl
• Assistant Examiner(s): MITCHELL, JAMES M
• Application Number:
  US10/103,801
• Publication Number:
  US 20030178720A1
• Time in Patent Office: 2,479 Days
• Field of Search: 257/706, 257/707, 257718-723, 257/704, 257/705, 257/717, 257/712
• US Class Current: 257/707
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.

Claims

1. A device comprising:

a heat dissipating member having a surface,; and

a B-stage polymer in a phase change thermal interface material attached to the surface of the heat dissipating member, wherein the B-stage polymer in the phase change thermal interface material has the property of being a solid at room temperature, of becoming a liquid at a first elevated temperature above room temperature, and of becoming a cured solid at a second elevated temperature above first temperature, wherein the phase change thermal interface material comprises a polymer matrix and particles of at least one thermally conductive filler dispersed throughout the polymer matrix, wherein the particles of the at least one thermally conductive filler are fusible particles, and wherein the particles of the at least one thermally conductive filler comprise fusible particles selected from the group consisting of In, In/Sn, In/Ag, Sn/Ag, Sn/In/Ag, Sn/Ag/Cu, Sn/Bi, In/Sn/Bi, In/Zn particles and combinations thereof.

2. The device of claim 1 wherein the heat dissipating member is a heat spreader.

3. The device of claim 1 wherein the heat dissipating member is a heat sink.

4. The device of claim 1 wherein the polymer matrix comprises a polymer selected from the group consisting of olefinic resins, silicones, acrylic resins, epoxies, urethanes, polyethers and acrylates.

5. The device of claim 1 wherein the phase change thermal interface material further includes a crosslinking agent.

6. The device of claim 1 wherein the polymer matrix cures at a second elevated temperature equal to or above the first elevated temperature.

7. The device of claim 1 wherein the particles of the at least one thermally conductive filler comprise non-fusible particles selected from the group consisting of Ni, Cu, Ag, Ag/Cu, Sn, graphite, diamond, carbon fiber, Al, alumina, boron nitride, aluminum nitride particles and combinations thereof.

8. The device of claim 1 wherein the phase change thermal interface material further includes a crosslinking agent selected from multifunctional amines, anhydrides, phenolic resins, hydride-functional siloxanes, polyols, peroxides, and azides.

9. The device of claim 1, wherein the heat dissipating member is a heat pipe.

10. A device comprising:

a heat dissipating member having a surface; and

a B-stage polymer in a phase change thermal interface material attached to the surface of the heat dissipating member, wherein the B-stage polymer in the phase change thermal interface material has the property of being a solid at room temperature, of becoming a liquid at a first elevated temperature above room temperature, and of becoming a cured solid at a second elevated temperature above first temperature, wherein the particles of the at least one thermally conductive filler are fusible particles, wherein the fusible particles are solder particles, and wherein the particles of the at least one thermally conductive filler comprise fusible particles selected from the group consisting of In, In/Sn, In/Ag, Sn/Ag, Sn/In/Ag, Sn/Ag/Cu, Sn/Bi, In/Sn/Bi, In/Zn particles and combinations thereof.

11. A device comprising:

a heat dissipating member having a surface; and

a B-stage polymer in a phase change thermal interface material attached to the surface of the heat dissipating member, wherein the B-stage polymer in the phase change thermal interface material has the property of being a solid at room temperature, of becoming a liquid at a first elevated temperature above room temperature, and of becoming a cured solid at a second elevated temperature above first temperature, wherein the phase change thermal interface material comprises a polymer matrix and particles of at least one thermally conductive filler dispersed throughout the polymer matrix, and wherein the particles of the at least one thermally conductive filler comprise fusible particles selected from the group consisting of In, In/Sn, In/Ag, Sn/Ag, Sn/In/Ag, Sn/Ag/Cu, Sn/Bi, In/Sn/Bi, In/Zn particles and combinations thereof.

12. A device comprising:

a heat dissipating member having a surface; and

a B-stage polymer in a phase change thermal interface material attached to the surface of the heat dissipating member, wherein the B-stage polymer in the phase change thermal interface material has the property of being a solid at room temperature, of becoming a liquid at a first elevated temperature above room temperature, and of becoming a cured solid at a second elevated temperature above first temperature, wherein the phase change thermal interface material comprises a polymer matrix and particles of at least one thermally conductive filler dispersed throughout the polymer matrix, wherein the particles of the at least one thermally conductive filler are fusible particles, wherein the particles of the at least one thermally conductive filler include both fusible particles and nonfusible particles, and wherein the fusible particles of the at least one thermally conductive filler comprise fusible particles selected from the group consisting of In, In/Sn, In/Ag, Sn/Ag, Sn/In/Ag, Sn/Ag/Cu, Sn/Bi, In/Sn/Bi, In/Zn particles and combinations thereof.