Semiconductor device having dielectric film having aperture portion
First Claim
1. A semiconductor device comprising:
- a first dielectric film having an aperture portion,a semiconductor layer formed in the aperture portion, anda second dielectric film over the first dielectric film and the semiconductor layer,wherein the second dielectric film contacts an upper surface outside the aperture portion of the first dielectric film and extends into the aperture portion to contact an inner side surface of the first dielectric film and a side surface of the semiconductor layer.
1 Assignment
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Accused Products
Abstract
In the semiconductor device having a structure in which a plurality of layers are built-up by layers made of different materials or layers including various formed patterns, it is an object to provide a method which smoothing surface can be achieved without a polishing treatment by CMP method or a smoothing process by depositing a SOG film, a substrate material is not chosen, and the smoothing is simple and easy. In the semiconductor device in which a plurality of different layers are formed, smoothing surface can be achieved without the polishing treatment by the CMP method or the smoothing process by depositing the SOG film to a dielectric film formed on a dielectric film and a wring (electrode) or a semiconductor layer in a manner that an aperture portion is formed in the dielectric film, the wring (electrode) or the semiconductor layer is formed in the aperture portion.
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Citations
35 Claims
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1. A semiconductor device comprising:
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a first dielectric film having an aperture portion, a semiconductor layer formed in the aperture portion, and a second dielectric film over the first dielectric film and the semiconductor layer, wherein the second dielectric film contacts an upper surface outside the aperture portion of the first dielectric film and extends into the aperture portion to contact an inner side surface of the first dielectric film and a side surface of the semiconductor layer. - View Dependent Claims (26)
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2. A semiconductor device comprising:
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a first dielectric film having an aperture portion, a wiring formed continuously from a bottom surface of the aperture portion to a first upper surface outside the aperture portion of the first dielectric film, and a second dielectric layer coating over the first dielectric layer and the wiring, wherein, in the second dielectric layer, a contact hole reached to the wiring is formed at a position where the wiring is formed on the first upper surface, wherein a depth of said aperture portion is shorter than a thickness of said first dielectric film, and wherein the second dielectric film contacts a second upper surface outside the aperture portion of the first dielectric film. - View Dependent Claims (23)
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3. A semiconductor device comprising:
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a first dielectric film having a first aperture portion, a wiring formed continuously from a bottom surface of the first aperture portion to a first upper surface outside the aperture portion of the first dielectric film, and a second dielectric film coating over the first dielectric layer and the wiring and having a second aperture portion, wherein at least a part of the second aperture portion is formed on an upper portion of a position where the wiring is formed on the first upper surface, and a contact hole reached to the wiring is formed corresponding to the position of a bottom surface of the second aperture portion, and wherein the second dielectric film contacts a second upper surface outside the aperture portion of the first dielectric film. - View Dependent Claims (4)
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5. A semiconductor device comprising:
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a first dielectric film having a first aperture portion and a second aperture portion adjacent to the first aperture portion; a wiring formed continuously from a bottom surface of the first aperture portion to a bottom surface of the second aperture portion through a first upper surface of the first dielectric film between the first aperture portion and the second aperture portion; and a second dielectric film over the first dielectric film and the wiring, wherein the second dielectric film contacts a second upper surface outside the first aperture portion and the second aperture portion of the first dielectric film and extends into the first aperture portion and the second aperture portion to contact an inner side surface of the first dielectric film and a side surface of the wiring. - View Dependent Claims (6)
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7. A semiconductor device comprising:
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a first dielectric film having a first aperture portion and a second aperture portion adjacent to the first aperture portion, a wiring formed continuously from a bottom surface of the first aperture portion to a bottom surface of the second aperture portion through a first upper surface of the first dielectric film between the first aperture portion and the second aperture portion, and a second dielectric film coating over the first dielectric layer and the wiring, wherein, in the second dielectric layer, a contact hole reached to the wiring is formed at a position where the wiring is formed on the first upper surface of the first dielectric film between the first aperture portion and the second aperture portion, and wherein the second dielectric film contacts a second upper surface outside the first aperture portion and the seond aperture portion of the first dielectric film. - View Dependent Claims (8)
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9. A semiconductor device comprising:
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a first dielectric film having a first aperture portion and a second aperture portion adjacent to the first aperture portion, a wiring formed continuously from a bottom surface of the first aperture portion to a bottom surface of the second aperture portion through a first upper surface of the first dielectric film between the first aperture portion and the second aperture portion, and a second dielectric film coating over the first dielectric layer and the wiring and having a third aperture portion, wherein at least a part of the third aperture portion is formed on an upper portion of a position where the wiring is formed on the first upper surface of the second dielectric film between the first aperture portion and the second aperture portion, and a contact hole reached to the wiring is formed corresponding to the position of a bottom surface of the third aperture portion, and wherein the second dielectric film contacts a secod upper surface outside the first aperture portion and the second aperture portion of the first dielectric film. - View Dependent Claims (10)
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11. A semiconductor device comprising:
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a first dielectric film having an aperture portion which is formed with the first dielectric film remained in an island shape inside the aperture portion; a wiring formed continuously inside the aperture portion and on an upper portion of the first dielectric film remained in the island shape; and a second dielectric film over the first dielectric film and the wiring, wherein the second dielectric film contacts an upper surface outside the aperture portion of the first dielectric film and extends into the aperture portion to contact an inner side surface of the first dielectric film and a side surface of the wiring. - View Dependent Claims (12)
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13. A semiconductor device comprising:
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a first dielectric film having an aperture portion which is formed with the first dielectric film remained in an island shape inside the aperture portion, a wiring formed continuously inside the aperture portion and on an upper portion of the first dielectric film remained in the island shape, and a second dielectric film coating over the first dielectric film and the wiring, wherein, in the second dielectric film, a contact hole reached to the wiring is formed at a position where the dielectric film remained in the island shape is formed, and wherein the second dielectric film contacts an upper surface outside the aperture portion of the first dielectric film. - View Dependent Claims (14)
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15. A semiconductor device comprising:
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a first dielectric film having a first aperture portion which is formed with the first dielectric film remained in an island shape inside the aperture portion, a wiring formed continuously inside the first aperture portion and on an upper portion of the first dielectric film remained in the island shape, and a second dielectric film coating over the first dielectric film and the wiring and having a second aperture portion, wherein at least a part of the second aperture portion is formed on an upper portion of a position where the wiring is formed on the upper portion of the first dielectric film remained in the island shape, and a contact hole reached to the wiring is formed corresponding to the position of a bottom surface of the second aperture portion, and wherein the second dielectric film contacts an upper surface outside the first aperture portion of the first dielectric film. - View Dependent Claims (16, 17)
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18. A semiconductor device comprising:
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a semiconductor film including a first impurity region and a second impurity region over an insulating surface; a gate insulating film adjacent to said semiconductor film; a gate electrode adjacent to said gate insulating film; a first insulating film over said semiconductor film; a second insulating film having a first aperture portion and a second aperture portion over said first insulating film, wherein a first projection is provided inside the first aperture portion; a first wiring formed in said first aperture portion and covering said first projection, wherein said first wiring is electrically connected to the first impurity region; a second wiring formed in said second aperture portion, wherein said second wiring is electrically connected to the second impurity region; and a third insulating film over the first wiring, the second wiring and the second insulating film, wherein the third insulating film contacts an upper surface outside the first aperture portion and the second aperture portion of the second insulating film. - View Dependent Claims (19, 20, 21, 24, 25, 28, 35)
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22. A semiconductor device comprising:
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a first dielectric film having an aperture portion, a semiconductor layer formed in the aperture portion, and a second dielectric film coating the first dielectric film and the semiconductor layer, wherein the second dielectric film contacts a top surface outside the aperture portion of the first dielectric film and extends into the aperture portion to contact an inner side surface of the first dielectric film and a side surface of the semiconductor layer, wherein the semiconductor layer is formed so that a top surface of said semiconductor layer is leveled with the top surface outside the aperture portion of the first dielectric film. - View Dependent Claims (27)
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29. A semiconductor device comprising:
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a first dielectric film having an aperture portion and a projection inside the aperture portion; a first wiring formed in said aperture portion and covering said projection; a second dielectric film formed over said first dielectric film and said first wiring, said second dielectric film having a contact hole; a second wiring formed over said second dielectric film wherein said second wiring is electrically connected to said first wiring through said contact hole, wherein the second dielectric film contacts an upper surface outside the aperture portion of the first dielectric film. - View Dependent Claims (30, 31)
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32. A semiconductor device comprising:
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a first dielectric film having a first aperture portion and a projection inside the first aperture portion; a first wiring formed in said first aperture portion and covering said projection; a second dielectric film formed over said first dielectric film and said first wiring, said second dielectric film having a second aperture portion and a contact hole in said second aperture portion; a second wiring formed in said second aperture portion, wherein said second wiring is electrically connected to said first wiring through said contact hole, wherein the second dielectric film contacts an upper surface outside the first aperture portion of the first dielectric film. - View Dependent Claims (33, 34)
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Specification