Electrical contact encapsulation

• US 7,475,964 B2
• Filed: 08/06/2004
• Issued: 01/13/2009
• Est. Priority Date: 08/06/2004
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Zhang, Steve H., Benson, Brad, Bretl, Frank J., Chappell, Ellen L., Igelman, M. Jeffery
• Primary Examiner(s): Vo; Anh T. N.
• Application Number:
  US10/913,101
• Publication Number:
  US 20060027937A1
• Time in Patent Office: 1,621 Days
• Field of Search: 347/50, 347/58, 347/86, 298/900.1, 257/734, 257/736, 257/783, 257/784
• US Class Current: 347/50
• CPC Class Codes: B41J 2/14072 Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

An electronic device comprises a substrate and an electrical contact in contact with the dielectric layer and electrically coupled with at least one resistor, a substrate carrier including an electrical trace electrically coupled to the electrical contact, a polymer enclosing the electrical contact, and a substantially planar film disposed over the electrical contact.

Claims

1. An electronic device comprising:

a substrate;

an electrical contact disposed on the substrate;

a lead electrically coupled to the electrical contact;

a polymer enclosing the electrical contact; and

a first film disposed over the electrical contact and in contact with the polymer;

a second film disposed over the first film.

2. The electronic device of claim 1 wherein the first film comprises a barrier layer.

3. The electronic device of claim 2 wherein the barrier layer is selected from a group consisting of silicon oxide, aluminum oxide, silicon oxide, sol gel, or a polymer.

4. The electronic device of claim 2 wherein the barrier layer has a thickness of between approximately 50 angstroms and 50 microns.

5. The electronic device of claim 1 wherein the second film has a thickness of between approximately 5 microns and 500 microns.

6. The electronic device of claim 1 wherein the second film is selected from a group consisting of polyester, polyimide, polyolefin, and polynaphthalate,

7. The electronic device of claim 1 wherein the second film is multilayer-structure.

8. The method of claim 7 wherein layers of the multilayer-structure are selected from a group consisting of polymers, glass, ceramic, and metal.

9. The electronic device of claim 8 wherein the polymer is a layer of adhesive attached to the first film.

10. The electronic device of claim 8 wherein the polymer is one of a paste adhesive or an epoxy.

11. The electronic device of claim 1 wherein the polymer is one of a paste adhesive or an epoxy.

12. The electronic device of claim 1 wherein the lead is a wire.

13. The electronic device of claim 1 wherein the first and second film are substantially planar.

14. The electronic device of claim 1 wherein the substrate is a fluid ejection device.

15. The electronic device of claim 1 wherein the lead is coupled with a flexible circuit.

16. The electronic device of claim 1 wherein the lead is coupled with a rigid circuit.

17. The electronic device of claim 1, wherein the second film is not in contact with the polymer.

18. An electronic device, comprising:

a substrate;

an electrical contact disposed on the substrate;

a lead electrically coupled to the electrical contact;

a polymer enclosing the electrical contact;

a substantially planar film disposed over the electrical contact and polymer and covering the polymer; and

a baffler layer disposed between the substantially planar film and the polymer.

19. The electronic device of claim 18 wherein the barrier is selected from a group consisting of silicon oxide, aluminum oxide, flexible silicon oxide (SiOx), sol gel, and a polymer.

20. The electronic device of claim 18 wherein the barrier layer has a thickness of between approximately 50 angstroms and 50 microns.

21. An electronic device comprising:

a substrate including at least one resistor disposed thereon, a dielectric layer disposed over at least a portion of the substrate, and an electrical conmet in contact with the dielectric layer and electrically coupled with the at least one resistor;

a substrate carrier including an electrical trace electrically coupled to the electrical contact;

a polymer enclosing the electrical contact;

a substantially planar film disposed over the electrical contact and polymer and covering all of the polymer; and

a harder layer disposed between the substantially planar film and the polymer.

22. The electronic device of claim 21 wherein the harrier is selected from a group consisting of silicon oxide, aluminum oxide, sol gel, or a polymer.

23. The electronic device of claim 21 wherein the barrier layer has a thickness of between approximately 50 angstroms and 50 microns.

24. A method of forming a contact comprising:

providing a substrate including an electrical contact;

providing a lead;

coupling at least part of the lead with the electrical contact;

encapsulating at least a portion of the lead and electrical contact that have been coupled;

applying a substantially planar film over the substrate so that at least a portion of the lead and electrical contact where coupled is covered by the film; and

applying a second film over the substantially planar film.

25. The method of claim 24 wherein the substantially planar film includes an adhesive coating applied to a surface thereof.