High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation

• US 7,476,291 B2
• Filed: 09/28/2006
• Issued: 01/13/2009
• Est. Priority Date: 09/28/2006
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Wang, Ing-Yann Albert, Chebi, Robert
• Primary Examiner(s): Cleveland; Michael
• Assistant Examiner(s): CHEN, KEATH T
• Application Number:
  US11/528,275
• Publication Number:
  US 20080078744A1
• Time in Patent Office: 838 Days
• Field of Search: 156/345.33
• US Class Current: 156/345.33
• CPC Class Codes: H01J 37/00 Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof H01J33/00, H01J40/00, H01J41/00, H01J47/00, H01J49/00 take precedence
• CPC Class Codes: H01J 37/16 Vessels; Containers
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/32834 Exhausting

Abstract

A vacuum chamber for passivation and/or stripping a photoresist layer formed on a semiconductor substrate. The chamber includes an internal chamber body that forms a cavity to surround the substrate and has a plurality of gas passages extending therethrough to the cavity and one or more heaters to heat the internal chamber body. The internal chamber body is slidably mounted on an external chamber body that surrounds a side of the internal chamber with a gap therebetween. The device also includes: an exhaust unit operative to pump the gas from the cavity; a chamber top mounted on the internal chamber body to cover a top surface of the internal chamber body with a gap therebetween and having an opening in fluid communication with the gas passages; and a plasma source operative to energize the gas into a plasma state and coupled to the opening for fluid communication with the cavity.

Claims

1. A vacuum chamber comprising:

a chamber top;

a gas distribution member and an external chamber body;

the gas distribution member comprising an internal chamber body configured to be slidably supported on the external chamber body with a gap between outer surfaces of the internal chamber body and inner surfaces of the external chamber body;

gas passages extending through a central upper portion of the internal chamber body, the gas passages adapted to direct process gas into the chamber towards the semiconductor substrate;

a domed inner surface adapted to overlie the substrate and confine the process gas in a space; and

a central upper vacuum sealing surface surrounding the gas passages and adapted to form a vacuum seal with a lower surface of the chamber top;

the external chamber body having a sidewall and an annular recess in an upper portion of the sidewall, slidably supporting the internal chamber body and configured to surround a side of said internal chamber body with a vacuum gap therebetween;

an exhaust unit operative to pump the process gas from said chamber;

the chamber top having a central portion thereof slidably mounted on the central upper portion of said internal chamber body so as to cover a top surface of said internal chamber body with an ambient gap therebetween outward of the central portion and having an opening in fluid communication with said gas passages; and

a plasma source operative to energize process gas and coupled to said opening for fluid communication with said opening in the chamber top.

2. The chamber as recited in claim 1, wherein at least some of said gas passages are angled to have axes thereof intersect an exposed surface of the substrate.

3. The chamber as recited in claim 1, further comprising one or more heaters supported by the internal chamber body and operable to heat the internal chamber body to a desired temperature.

4. The chamber as recited in claim 1, further including one or more temperature sensors operable to monitor the temperature of said internal chamber body.

5. The chamber as recited in claim 1, wherein said internal chamber body is a metal body which includes a projection which forms metal-to-metal contact and the vacuum seal with the chamber top.

6. The chamber as recited in claim 1, wherein the internal chamber body comprises a main body and an upper plate in which the gas passages are located, the main body including an opening in an upper wall thereof, the upper wall including a vacuum sealing surface surrounding the opening, the upper plate including the central upper vacuum sealing surface surrounding the gas passages, and an O-ring fitted between the vacuum sealing surfaces of the upper plate and the main body so as to form a vacuum seal therebetween.

7. The chamber as recited in claim 1, wherein the gas distribution member comprises a lower vacuum surface surrounding an outer sidewall of the member and adapted to form a vacuum seal with an upper surface on an upper portion of a sidewall of the chamber.

8. The chamber as recited in claim 1, wherein the gas distribution member comprises a top wall, sidewall and bottom wall, the top wall having a thickness which increases towards an outer periphery thereof, the sidewall having a thickness which is greater at an upper portion thereof, and the bottom wall having a central opening therein sized to allow the member to be lowered into the chamber such that a substrate support located at the bottom of the chamber can fit within the central opening.

9. The chamber as recited in claim 1, wherein the gas passages have inlets across a first zone and outlets across a second zone larger in area than the first zone, the second zone extending across an area no more than 50% of the area of the exposed surface of a substrate to be processed in the chamber, the gas outlets being oriented such that inner gas outlets direct process gas toward a central region of the substrate and outer gas outlets direct process gas toward an outer region of the substrate.

10. The chamber as recited in claim 1, wherein said external chamber body includes at least one channel operable to flow cooling fluid therethrough to remove heat from said external chamber body.

11. The chamber as recited in claim 10, further comprising a feedback control system operable to control the flow rate of said cooling fluid through said channel.

12. The chamber as recited in claim 1, further including a temperature adjustment system that is coupled to one or more temperature sensors and provides automatic adjustment of the temperature of said internal chamber body.

13. The chamber of claim 12, wherein the temperature adjustment system maintains the temperature of the internal chamber body in the range of 20 to 50°

C., 50 to 100°

C., 100 to 150°

C., 150 to 200°

C., 200 to 250°

C., 250 to 300°

C. or 300 to 350°

C.

14. A method of processing a semiconductor substrate in the chamber of claim 13, wherein the temperature adjustment system maintains the temperature of the internal chamber body in the range of 20 to 50°

C., 50 to 100°

C., 100 to 150°

C., 150 to 200°

C., 200 to 250°

C., 250 to 300°

C. or 300 to 350°

C. during plasma processing an exposed surface of the semiconductor substrate.

15. The method of claim 14, wherein the semiconductor substrate is a wafer and the plasma processing comprises stripping a photoresist layer from the wafer.

16. The chamber as recited in claim 1, wherein said internal chamber body is positioned on said external chamber body by a plurality of slots and pins, wherein each of said slots extends along a radial direction of said internal chamber body, is formed in said internal chamber body, and is configured to allow a corresponding pin to slide therealong, and wherein said pins are secured to said external chamber body.

17. The chamber as recited in claim 1, wherein said chamber top includes at least one channel operable to flow cooling fluid therethrough to remove heat energy from said chamber top.

18. The chamber as recited in claim 17, further comprising a feedback control system operable to cooperate with a temperature controlled fluid circulation system which circulates cooling fluid through said channel.

19. A method of processing a semiconductor substrate comprising:

supporting a semiconductor substrate in the vacuum chamber according to claim 1;

generating plasma by use of the plasma source; and

processing the semiconductor substrate with the plasma.

20. The method of claim 19, wherein the semiconductor substrate is a wafer and the processing comprises a step of stripping a photoresist layer on the wafer.

21. The method of claim 19, wherein the semiconductor substrate is a wafer and the processing comprises post-metal etch passivation.