Semiconductor input control device
First Claim
1. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
- a force sensor die formed within semiconductor substrate and containing;
a force sensor providing electrical output signal in response to applied external force, connection elements for electrical and mechanical connection within an electronic system;
a package;
enclosing a part of the force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die;
wherein connection elements of the force sensor die are exposed for direct mounting of the semiconductor input control device within an electronic system.
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Abstract
A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices is disclosed. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, connection elements for either flip chip mounting or wire bonding. Signal conditioning and processing integrated circuit is integrated within the device. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element coupled to the sensor die for transferring an external force to the force sensor die. A button, which has multiple ergonomical designs, is mechanically coupled to the force-transferring element of the package for providing an interface with the external force.
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Citations
35 Claims
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1. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
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a force sensor die formed within semiconductor substrate and containing; a force sensor providing electrical output signal in response to applied external force, connection elements for electrical and mechanical connection within an electronic system; a package; enclosing a part of the force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die; wherein connection elements of the force sensor die are exposed for direct mounting of the semiconductor input control device within an electronic system. - View Dependent Claims (2, 3, 4)
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5. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
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a force sensor die formed within semiconductor substrate and containing; a force sensor providing electrical output signal in response to applied external force, connection elements for flip chip mounting; a package comprising; a substrate; and a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die; wherein the force sensor die is flip-chip mounted on the substrate. - View Dependent Claims (6, 7, 8, 9, 10)
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11. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:
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a force sensor die formed within semiconductor substrate and having; a planar side with at least two contact pads; a force applying die side, which is opposite to planar side; and a force sensor providing electrical output signal in response to applied external force, a package; containing the force sensor die and comprising; a die-mounting element having an opening; a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die; and at least two output leads for electrical connection to contact pads of the sensor die; wherein the force sensor die is attached to the die mounting element such that; the force applying die side is facing the opening; the planar side of the die is facing away from the opening and away from the force-transferring element; the force-transferring element of the package is coupled to the force sensor die through the opening. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. Semiconductor input control device for inputting mechanical signals into a digital system comprising:
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a force sensor die formed within semiconductor substrate and having; a planar side; a force applying die side, which is opposite to the planar side; and a force sensor providing electrical output signal in response to applied external force, and connection elements for flip chip mounting; a package; containing a force sensor die and comprising; a package body having an external mounting surface not parallel to the planar side of the force sensor die; a die-mounting element; a force-transferring element, which is coupled to the force sensor die and transfers an external force to the force sensor die; and at least two output leads located on the external mounting surface; wherein said semiconductor input control device is mounted on PCB such that the planar side of the force sensor die is not parallel to the PCB and the external mounting surface is facing the PCB. - View Dependent Claims (21, 22, 23)
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24. Semiconductor input control device for inputting mechanical signals into a digital system comprising:
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at least one die providing functions of force sensing, signal conditioning and signal processing; a package containing a die providing at least a function of force sensing and comprising a force-transferring element, which is coupled to the force sensing die and transfers an external force to the force sensing die; wherein a partitioning between force sensing, signal conditioning and signal processing functions is chosen from the group consisting of;
integration of force sensing, signal conditioning and signal processing functions within one force sensing die;
integration of force sensing and at least some signal conditioning within one die and at least signal processing within the other die;
integration of force sensing within one die and signal conditioning within the other die;
integration of force sensing within one die and signal conditioning and signal processing within at least one other die.
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25. Semiconductor input control device for inputting mechanical signals into a digital system comprising:
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a force sensor die formed within semiconductor substrate and providing electrical output signal in response to applied external force; a package containing a force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die; a button mechanically coupled to the force-transferring element of the package, wherein the button provides an interface with the external force and transfers it to the force-transferring element, which transfers force to the force sensor die. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
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33. Semiconductor input control device for inputting mechanical signals into a digital system comprising:
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a force sensor die formed within semiconductor substrate and providing electrical output signal in response to applied external force; a package containing a force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die; wherein the package is mounted on a PCB and mechanical coupling to the PCB is chosen from the group of;
soldering, underfill adhesive, adhesive applied around the sidewalls of the package and PCB surface, metal bracket or combination of the above. - View Dependent Claims (34)
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35. Semiconductor input control device for inputting mechanical signals into a digital system comprising:
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a force sensor die formed within semiconductor substrate and providing electrical output signal in response to applied external force; a package containing a force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die; wherein said device is mounted on an object in the location chosen from the group of;
front, back, top, bottom, left side, right side, front panel, edge, control panel, control area, sidewall, handle, steering wheel, external surface, inside the object or combination of the above.
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Specification