Semiconductor input control device

• US 7,476,952 B2
• Filed: 05/21/2007
• Issued: 01/13/2009
• Est. Priority Date: 12/28/2004
• Status: Expired due to Fees

• Current Assignee: Nickolai Belov, Vladimir Vaganov
• Original Assignee: Nickolai Belov, Vladimir Vaganov
• Inventors: Belov, Nickolai, Vaganov, Vladimir
• Primary Examiner(s): Geyer; Scott B.
• Application Number:
  US11/804,954
• Publication Number:
  US 20070264743A1
• Time in Patent Office: 603 Days
• Field of Search: 257/E23.001, 257/E23.002, 257/E23.116, 257/E23.123, 257/E23.124, 257/E23.128, 257/E23.18, 257/E23.194
• US Class Current: 257/415
• CPC Class Codes: G06F 3/0338 with detection of limited linear or angular displacement of an operating part of the device from a neutral position, e.g. isotonic or isometric joysticks
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices is disclosed. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, connection elements for either flip chip mounting or wire bonding. Signal conditioning and processing integrated circuit is integrated within the device. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element coupled to the sensor die for transferring an external force to the force sensor die. A button, which has multiple ergonomical designs, is mechanically coupled to the force-transferring element of the package for providing an interface with the external force.

Claims

1. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:

a force sensor die formed within semiconductor substrate and containing;

a force sensor providing electrical output signal in response to applied external force, connection elements for electrical and mechanical connection within an electronic system;

a package;

enclosing a part of the force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die;

wherein connection elements of the force sensor die are exposed for direct mounting of the semiconductor input control device within an electronic system.

2. A device of claim 1, wherein an external force is applied directly to the force-transferring element of the package.

3. A device of claim 1, wherein the force sensor die has a rigid force-transferring element coupled to the force-transferring element of the package for better and multi-axis sensitivity of the device.

4. A device of claim 1, wherein the force-transferring element coupled to the sensor die is made from plastic materials chosen from the group of:

one layer uniform material, at least two layers of uniform materials, non-uniform plastic material with gradient of hardness or combination of the above.

5. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:

a force sensor die formed within semiconductor substrate and containing;

a force sensor providing electrical output signal in response to applied external force, connection elements for flip chip mounting;

a package comprising;

a substrate;

and a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die;

wherein the force sensor die is flip-chip mounted on the substrate.

6. A device of claim 5, wherein an external force is applied directly to the force-transferring element of the package.

7. A device of claim 5 further comprising at least one signal conditioning and processing integrated circuit die providing conditioning and processing of the output signals from the force sensor, wherein the force sensor die and at least one signal conditioning and processing integrated circuit die are mounted on the substrate

8. A device of claim 5, wherein the force sensor die is flip-chip mounted on the additional integrated circuit die.

9. A device of claim 5, wherein the force sensor die has a rigid force-transferring element coupled to the force-transferring element of the package for better and multi-axis sensitivity of the device.

10. A device of claim 5, wherein the force-transferring element coupled to the sensor die is made from plastic materials chosen from the group of:

one layer uniform material, at least two layers of uniform materials, non-uniform plastic material with gradient of hardness or combination of the above.

11. Semiconductor input control device for inputting mechanical signals into an electronic system comprising:

a force sensor die formed within semiconductor substrate and having;

a planar side with at least two contact pads;

a force applying die side, which is opposite to planar side; and

a force sensor providing electrical output signal in response to applied external force,

a package;

containing the force sensor die and comprising;

a die-mounting element having an opening;

a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die; and

at least two output leads for electrical connection to contact pads of the sensor die;

wherein the force sensor die is attached to the die mounting element such that;

the force applying die side is facing the opening;

the planar side of the die is facing away from the opening and away from the force-transferring element;

the force-transferring element of the package is coupled to the force sensor die through the opening.

12. A device of claim 11, wherein an external force is applied directly to the force-transferring element.

13. A device of claim 11 further comprising at least one signal conditioning and processing integrated circuit die providing conditioning and processing of the output signals from the force sensor, wherein the force sensor die and at least one signal conditioning and processing integrated circuit die are mounted on the substrate.

14. A device of claim 11, wherein electrical connection to the contact pads on the planar side of the force-sensor die are made via wire bonding.

15. A device of claim 11, wherein the package further comprises a cap, and said cap is positioned within the package in such a way that the planar side of the force-sensor die is facing this cap.

16. A device of claim 15, wherein the output leads of the package are located on the cap.

17. A device of claim 11, wherein the force sensor die and the surface of the die-mounting element are at least partially covered with plastic material chosen from the group of:

molding materials, potting materials, gels, rubber-like materials and combination of the above.

18. A device of claim 11, wherein the package has a cavity and the die-mounting element is located within the cavity.

19. A device of claim 11, wherein die-mounting element is made from the material chosen from the group of:

plastic, metal, ceramic, glass, semiconductor and combination of the above.

20. Semiconductor input control device for inputting mechanical signals into a digital system comprising:

a force sensor die formed within semiconductor substrate and having;

a planar side;

a force applying die side, which is opposite to the planar side; and

a force sensor providing electrical output signal in response to applied external force, and connection elements for flip chip mounting;

a package;

containing a force sensor die and comprising;

a package body having an external mounting surface not parallel to the planar side of the force sensor die;

a die-mounting element;

a force-transferring element, which is coupled to the force sensor die and transfers an external force to the force sensor die; and

at least two output leads located on the external mounting surface;

wherein said semiconductor input control device is mounted on PCB such that the planar side of the force sensor die is not parallel to the PCB and the external mounting surface is facing the PCB.

21. A device of claim 20, wherein an external force is applied directly to the force-transferring element.

22. A device of claim 20, wherein the package has a groove and the external mounting surface is located on at least one side wall of the groove.

23. A semiconductor input control device of claim 20, wherein the device is mounted on an edge of the PCB such that the planar side of the force sensor die is perpendicular to the PCB.

24. Semiconductor input control device for inputting mechanical signals into a digital system comprising:

at least one die providing functions of force sensing, signal conditioning and signal processing;

a package containing a die providing at least a function of force sensing and comprising a force-transferring element, which is coupled to the force sensing die and transfers an external force to the force sensing die;

wherein a partitioning between force sensing, signal conditioning and signal processing functions is chosen from the group consisting of;

integration of force sensing, signal conditioning and signal processing functions within one force sensing die;

integration of force sensing and at least some signal conditioning within one die and at least signal processing within the other die;

integration of force sensing within one die and signal conditioning within the other die;

integration of force sensing within one die and signal conditioning and signal processing within at least one other die.

25. Semiconductor input control device for inputting mechanical signals into a digital system comprising:

a force sensor die formed within semiconductor substrate and providing electrical output signal in response to applied external force;

a package containing a force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die;

a button mechanically coupled to the force-transferring element of the package,

wherein the button provides an interface with the external force and transfers it to the force-transferring element, which transfers force to the force sensor die.

26. A device of claim 25, wherein the force-transferring element and the button are coupled across a surface having at least one additional element with a shape chosen from the group consisting of:

hole, cavity, trench, notch, pole, pin, rim, step, bar, thread, tooth, hook, locking mechanism or combination of the above.

27. A device of claim 25, wherein the button has a connector to the force-transferring element, said connector allows replacing or interchanging the buttons.

28. A device of claim 25, wherein the button has a profiled connector to the force-transferring element, said connector has at its surface at least one additional mechanical element protecting the semiconductor input control device from mechanical force and torque overload.

29. A device of claim 25, wherein the button is integrated in a control panel chosen from the group consisting of:

keyboard, key-mat, control surface area or combination of the above.

30. A device of claim 25, wherein the button is made from the material chosen from the group consisting of:

plastic, metal, ceramic, glass, polymer, gem or combination of the above.

31. A device of claim 25, wherein the button has a color chosen from the group consisting of:

red, orange, yellow, green, blue, magenta, violet, black or combination of the above.

32. A device of claim 25, wherein the button has shape elements chosen from the group consisting of:

convex, concave, saddle, cylinder, disk, dome, stick, hemisphere, cone, pyramid, prism, tore, dimple, notch, tactile recognizable feature, or combination.

33. Semiconductor input control device for inputting mechanical signals into a digital system comprising:

a force sensor die formed within semiconductor substrate and providing electrical output signal in response to applied external force;

a package containing a force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die;

wherein the package is mounted on a PCB and mechanical coupling to the PCB is chosen from the group of;

soldering, underfill adhesive, adhesive applied around the sidewalls of the package and PCB surface, metal bracket or combination of the above.

34. A device of claim 33, wherein the underfill adhesive is elastic and provides protection against mechanical shock and force overload applied to the device.

35. Semiconductor input control device for inputting mechanical signals into a digital system comprising:

a force sensor die formed within semiconductor substrate and providing electrical output signal in response to applied external force;

a package containing a force sensor die and comprising a force-transferring element, which is coupled to the sensor die and transfers an external force to the force sensor die;

wherein said device is mounted on an object in the location chosen from the group of;

front, back, top, bottom, left side, right side, front panel, edge, control panel, control area, sidewall, handle, steering wheel, external surface, inside the object or combination of the above.