Revenue meter bayonet assembly and method of attachment

• US 7,478,003 B2
• Filed: 07/05/2005
• Issued: 01/13/2009
• Est. Priority Date: 08/09/1999
• Status: Expired due to Fees

• Current Assignee: Markus F. Hirschbold, Peter C. Cowan
• Original Assignee: Markus F. Hirschbold, Peter C. Cowan
• Inventors: Hirschbold, Markus F., Cowan, Peter C.
• Primary Examiner(s): Raymond; Edward
• Application Number:
  US11/175,123
• Publication Number:
  US 20060015271A1
• Time in Patent Office: 1,288 Days
• Field of Search: 702/117, 702/118, 702182-185, 324/104
• US Class Current: 702/117
• CPC Class Codes: G01R 22/065 related to mechanical aspects
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias
• CPC Class Codes: H05K 2201/09854 Hole or via having special cross-section, e.g. elliptical
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3468 Applying molten solder
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A method and arrangement are disclosed for attaching one or more electrical bayonet-type blades to a circuit board with the bayonets being used to receive voltage and current signals from the electric circuit of an electrical meter. The arrangement includes a circuit board with at least one opening adapted to receive one blade. In addition, a sensor is coupled with the electric circuit to sense at least one electrical parameter from the circuit and generating a corresponding analog signal. A solder pad disposed on at least one surface of board surrounds the opening. Solder is applied around the electrically conducting bayonet on one surface of the circuit board and around the electrically conducting bayonet of the surface of the circuit board opposite to the solder pad.

Claims

1. A circuit board device having a bayonet, comprising:

a circuit board with at least one opening adapted to receive the bayonet;

at least one electrically conducting bayonet mounted on the circuit board through the opening wherein a gap is provided between the opening and the bayonet; and

solder passing through the gap and extending to both sides of the circuit board.

2. The device of claim 1 further comprising a second bayonet mounted on the circuit board electrically connected to the bayonet by an electrical connection.

3. The device of claim 2 wherein the electrical connection is embedded onto the circuit board.

4. The device of claim 1 wherein the circuit board comprises a multi-layer printed circuit board.

5. The device of claim 4 wherein the electrical connection comprises an electrical trace embedded between at least a first layer and a second layer of the multi-layer printed circuit board.

6. The device of claim 1 wherein the at least one opening comprises thru-hole plating.

7. The device of claim 1 wherein the opening is surrounded by at least two vias.

8. The device of claim 7 wherein the vias comprise a size of about 0.018 inches to about 0.100 inches wide.

9. The device of claim 1 wherein the solder is passed with a wave solder machine.

10. The device of claim 1 wherein the solder is passed by dipping the bayonet into the solder, allowing the solder to cool and form a coating, inserting the coated bayonet into the opening and then heating the coated bayonet to permit reflow of the solder.

11. A method for manufacturing a circuit board having at least one bayonet, the circuit board comprising at least one opening adapted to receive the bayonet, the method comprising:

inserting the bayonet through the opening in the circuit board;

applying solder to the circuit board such that the solder is capable of flowing through a gap, wherein the gap is provided between the opening and the bayonet.

12. The method of claim 11 wherein the solder is applied using a solder pot.

13. The method of claim 11 where the solder is applied using a wave solder machine.

14. The method of claim 11 further including placement of other electrical modules before applying solder to the circuit board.

15. The method of claim 14 wherein the other electrical module comprise transient suppression devices.

16. The method of claim 11 wherein the electrical connection is embedded onto the circuit board.

17. The method of claim 11 further comprising supplying a second bayonet mounted on the circuit board electrically connected to the bayonet by an electrical connection.

18. The method of claim 17 wherein the electrical connection comprises an electrical trace.

19. The method of claim 11 wherein the at least one opening comprises thru-hole plating.

20. The method of claim 11 wherein the opening is surrounded by at least two vias.

21. The method of claim 11 wherein applying the solder further comprises:

dipping the bayonet into the solder;

allowing the solder to cool and form a coating;

inserting the coated bayonet into the opening; and

heating the coated bayonet to permit reflow of the solder.