UV curable protective encapsulant

• US 7,479,653 B2
• Filed: 12/04/2003
• Issued: 01/20/2009
• Est. Priority Date: 12/04/2003
• Status: Expired due to Fees

• Current Assignee: Henkel AG & Co KGaA
• Original Assignee: Henkel AG & Co KGaA
• Inventors: Van Wuytswinkel, Grete, Gillissen, Stijn
• Primary Examiner(s): Harlan; Robert D.
• Application Number:
  US10/727,951
• Publication Number:
  US 20050121665A1
• Time in Patent Office: 1,874 Days
• Field of Search: 257/40, 427/96.2, 524/559
• US Class Current: 257/40
• CPC Class Codes: C08F 290/067 Polyurethanes; Polyureas
• CPC Class Codes: C08L 33/14 of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
• CPC Class Codes: C08L 75/16 having terminal carbon-to-carbon unsaturated bonds
• CPC Class Codes: C09D 4/06 Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
• CPC Class Codes: H01C 1/02 Housing; Enclosing; Embedding; Filling the housing or enclosure
• CPC Class Codes: H01G 2/10 Housing; Encapsulation
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 9/08 Housing; Encapsulation
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention discloses encapsulant materials for use in glob top and/or dam and fill applications comprising base oligomer/monomers preferably having an acrylated/methacrylated or vinylene-containing oligomer/polymer, one or more multifunctional acrylate monomers, one or more thixotropic agents and, optionally, fillers, additives, photoinitiators and/or pigments. The encapsulant has low levels of water absorption and shrinkage.

Claims

1. An encapsulation composition comprising one or more base oligomer/polymers;

one or more diacrylate monomers selected from the group consisting of tricyclodecane dimethanol diacrylate, hydroxypivalaldehyde modified trimethyloipropane diacrylate and mixtures thereof;

one or more thixotropic agents; and

one or more filler materials selected from the group consisting of spherical hollow glass beads, solid glass beads, talc, spherical silica and mixtures thereof.

2. The encapsulation composition of claim 1, wherein the diacrylate monomer is tricyclodecane dimethanol diacrylate.

3. The encapsulation composition of claim 1, wherein the one or more base oligomer/polymers is an acrylated/methacrylated or vinylene-containing oligomer/polymer.

4. The encapsulation composition of claim 1, wherein the thixotropic agent is treated silica.

5. The encapsulation composition of claim 1, further comprising a silane coupling agent.

6. The encapsulation composition of claim 1, wherein the one or more base oligomer/polymers comprises in the range of about 1 to about 75 weight percent of the composition.

7. The encapsulation composition of claim 6, wherein the one or more base oligomer/polymers comprises in the range of about 20 to about 50 weight percent of the composition.

8. The encapsulation composition of claim 1, wherein the one or more diacrylate monomers comprise in the range of about 1 to about 50 weight percent of the composition.

9. The encapsulation composition of claim 8, wherein the one or more diacrylate monomers comprise in the range of about 10 to about 30 weight percent of the composition.

10. The encapsulation composition of claim 1, wherein the thixotropic agent comprises in the range of about 0.1 to about 8 weight percent of the composition.

11. The encapsulation composition of claim 10, wherein the thixotropic agent comprises in the range of about 2 to about 5 weight percent of the composition.

12. The encapsulation composition of claim 1, wherein the one or more filler materials comprise in the range of about 1 to about 85 weight percent of the composition.

13. The encapsulation composition of claim 12, wherein the one or more filler materials comprise in the range of about 50 to about 75 weight percent of the composition.

14. A method of providing encapsulation on an electronic component comprising the step of applying the composition of claim 1 to an electronic component.