Detachable electrostatic chuck for supporting a substrate in a process chamber
First Claim
1. An electrostatic chuck for attachment to a pedestal in a substrate processing chamber capable of processing a substrate in an energized process gas, the electrostatic chuck comprising:
- (a) at least one electrode capable of being charged to energize a process gas;
(b) a dielectric covering the electrode;
(c) a frontside surface to receive a substrate;
(d) an annular flange; and
(e) a backside surface comprising a central protrusion having asymmetrically offset orifices for receiving electrode terminal posts and a gas tube, wherein at least one orifice is offset from another orifice by an angle of from about 115 to about 135°
.
1 Assignment
0 Petitions
Accused Products
Abstract
A detachable electrostatic chuck can be attached to a pedestal in a process chamber. The electrostatic chuck has an electrostatic puck comprising a dielectric covering at least one electrode and a frontside surface to receive a substrate. A backside surface of the chuck has a central protrusion that can be a D-shaped mesa to facilitate alignment with a mating cavity in the pedestal. The protrusion can also have asymmetrically offset apertures, which further assist alignment, and also serve to receive electrode terminal posts and a gas tube. A heat transfer plate having an embedded heat transfer fluid channel is spring loaded on the pedestal to press against the chuck for good heat transfer.
-
Citations
31 Claims
-
1. An electrostatic chuck for attachment to a pedestal in a substrate processing chamber capable of processing a substrate in an energized process gas, the electrostatic chuck comprising:
-
(a) at least one electrode capable of being charged to energize a process gas; (b) a dielectric covering the electrode; (c) a frontside surface to receive a substrate; (d) an annular flange; and (e) a backside surface comprising a central protrusion having asymmetrically offset orifices for receiving electrode terminal posts and a gas tube, wherein at least one orifice is offset from another orifice by an angle of from about 115 to about 135°
. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. An electrostatic chuck for attachment to a pedestal in a substrate processing chamber capable of processing a substrate in an energized process gas, the electrostatic chuck comprising:
-
(a) at least one electrode capable of being charged to energize a process gas; (b) a dielectric covering the electrode; (c) a frontside surface to receive a substrate; (d) an annular flange; and (e) a backside surface comprising a D-shaped mesa surrounded by an annular trough, the D-shaped mesa comprising asymmetrically offset orifices that include at least one orifice that is offset from another orifice by an angle of from about 115 to about 135°
. - View Dependent Claims (10, 11)
-
-
12. A substrate support for a substrate processing chamber capable of processing a substrate in an energized process gas, the support comprising:
-
(a) an electrostatic puck comprising a dielectric covering at least one electrode capable of being charged to energize a process gas and having a frontside surface to receive a substrate; (b) a base plate attached to the electrostatic puck, the base plate comprising (i) a composite of porous ceramic and infiltrated metal, (ii) an annular flange extending beyond the periphery of the dielectric, and (iii) a backside surface comprising a central protrusion with a circular contour portion having a radial center, the central protrusion having asymmetrically offset orifices for receiving electrode terminal posts and a gas tube, the orifices being offset from one another by asymmetric angles which are measured from the radial center of the circular contour portion; and (c) a pedestal having a peripheral ledge capable of being attached to the annular flange of the base plate, and a cavity shaped to correspond to, and receive, the central protrusion of the base plate. - View Dependent Claims (13, 14, 15, 27, 28)
-
-
16. A substrate support for a substrate processing chamber capable of processing a substrate in an energized process gas, the support comprising:
-
(a) an electrostatic chuck comprising; (i) an electrostatic puck comprising a dielectric covering at least one electrode capable of being charged to energize a process gas and having a frontside surface to receive a substrate; and (ii) a base plate below the electrostatic puck, the base plate having an annular flange, and a backside surface comprising a central protrusion with a circular contour portion having a radial center, the central protrusion having asymmetrically offset orifices for receiving electrode terminal posts and a gas tube, the orifices being offset from one another by asymmetric angles which are measured from the radial center of the circular contour portion; (b) a pedestal having a peripheral ledge to attach to the annular flange of the base plate of the electrostatic chuck; and (c) a spring loaded heat transfer plate on the pedestal to contact the electrostatic chuck, the heat transfer plate comprising (i) a fluid channel, (ii) a first plate comprising a first material, and (iii) a second plate comprising a second material that is a different material from the first material, the second plate positioned below the first plate. - View Dependent Claims (17, 18, 19, 20, 21, 29, 30, 31)
-
-
22. An electrostatic chuck for attachment to a pedestal in a substrate processing chamber capable of processing a substrate in an energized process gas, the pedestal having a groove, the electrostatic chuck comprising:
-
(a) at least one electrode capable of being charged to energize the process gas; (b) a dielectric covering the electrode; (c) a frontside surface to receive a substrate; (d) an annular flange; (e) a backside surface comprising a central protrusion having orifices for receiving electrode terminal posts and a gas coupler; (f) a first polished ring encircling the gas coupler; and (g) a second polished ring that is radially outward from the first polished ring, wherein the first and second polished rings receive an O-ring which sits in the groove in the pedestal in the chamber. - View Dependent Claims (23, 24, 25, 26)
-
Specification