Thin, passive cooling system

• US 7,480,145 B2
• Filed: 11/01/2006
• Issued: 01/20/2009
• Est. Priority Date: 11/01/2006
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Ali, Ihab A.
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): PAPE, ZACHARY
• Application Number:
  US11/591,926
• Publication Number:
  US 20080101026A1
• Time in Patent Office: 811 Days
• Field of Search: 361704-708, 361714-715, 361/719, 165/185, 174/15.1, 257/712, 257/713
• US Class Current: 361/708
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H05K 7/20481 characterised by the material composition exhibiting specific thermal properties
• CPC Class Codes: H05K 7/20518 Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

Abstract

A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

Claims

1. A system, comprising:

a power source; and

a heat-shield mechanism which encloses the power source,

wherein the heat-shield mechanism includes;

a housing which is 3-dimensional, wherein the housing defines a cavity in which the power source resides, wherein an edge of the housing defines an opening to the cavity, wherein the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer, and wherein the second layer has a first anisotropic thermal conductivity; and

a plate which includes a material having a second anisotropic thermal conductivity, wherein the plate is positioned to cover the opening to the cavity thereby enclosing the power source.

2. The system of claim 1, wherein the first layer has a thickness less than or equal to 0.1 mm.

3. The system of claim 1, wherein the second layer has a thickness less than or equal to 0.1 mm.

4. The system of claim 1, wherein the third layer has a thickness less than or equal to 0.1 mm.

5. The system of claim 1, wherein the first layer and the third layer include metal.

6. The system of claim 5, wherein the metal includes aluminum, copper, magnesium, an aluminum alloy, a copper alloy, or a magnesium alloy.

7. The system of claim 1, wherein the plate is covered by an overcoat.

8. The system of claim 7, wherein the overcoat includes a polymer.

9. The system of claim 7, wherein the overcoat includes Mylar®

.

10. The system of claim 1, wherein the plate is coupled to a surface inside of the system.

11. The system of claim 1, wherein the second layer includes graphite, and wherein the plate includes graphite.

12. The system of claim 1, wherein the power source is associated with an integrated circuit.

13. The system of claim 1, wherein the heat-shield mechanism provides passive cooling of the power source.

14. The system of claim 1, wherein the system includes a portable computing device.

15. The system of claim 1, wherein the system ensures that a temperature on an outer surface of the system is less than a pre-determined value.

16. The system of claim 15, wherein the pre-determined value is less than 50 C.

17. The system of claim 1, wherein the system ensures that a temperature inside of the heat-shield mechanism is less than a pre-determined value.

18. The system of claim 17, wherein the pre-determined value is less than 80 C.

19. The system of claim 1, wherein the housing has a weight less than or equal to a pre-determined value.

20. The system of claim 19, wherein the pre-determined value is 5 grams.