Method and apparatus for providing hermetic electrical feedthrough
First Claim
Patent Images
1. A method of fabricating a hermetic electrical feedthrough comprising:
- providing an unfired ceramic sheet having upper and lower surfaces;
forming an intermediate blind hole in said ceramic sheet extending from said upper surface toward said lower surface;
inserting a wire into said blind hole;
firing said sheet and wire to a temperature sufficient to sinter the sheet material and cause it to form a hermetic compression seal around said wire; and
removing sufficient sheet material from said sheet lower surface to expose said wire thus forming a through hole containing said wire.
2 Assignments
0 Petitions
Accused Products
Abstract
A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≦40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient'"'"'s body. The method involves:
- (a) providing an unfired, ceramic sheet having a thickness of ≦40 mils and preferably comprising >99% aluminum oxide;
- (b) forming multiple blind holes in said sheet;
- (c) inserting solid wires, preferably of platinum, in said holes;
- (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and
- (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.
129 Citations
21 Claims
-
1. A method of fabricating a hermetic electrical feedthrough comprising:
-
providing an unfired ceramic sheet having upper and lower surfaces; forming an intermediate blind hole in said ceramic sheet extending from said upper surface toward said lower surface; inserting a wire into said blind hole; firing said sheet and wire to a temperature sufficient to sinter the sheet material and cause it to form a hermetic compression seal around said wire; and removing sufficient sheet material from said sheet lower surface to expose said wire thus forming a through hole containing said wire. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method of forming multiple hermetic electrical feedthroughs comprising the sequential steps of:
-
forming multiple intermediate blind holes in an unfired sheet of ceramic material, each hole extending from an upper sheet surface to a hole floor spaced from the lower surface of said sheet; inserting a wire into each hole so that the lower end of each wire is supported on a hole floor; firing said sheet and wires to sinter and shrink said ceramic material to form a hermetic compression seal around each wire; and removing ceramic material from said sheet lower surface to said hole floors to expose the lower ends of said wires thus forming through holes containing said wires. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
-
-
18. A method of fabricating a hermetic electrical feedthrough comprising:
-
providing an unsintered ceramic sheet having upper and lower surfaces; forming one or more intermediate blind holes in said ceramic sheet extending from said upper surface toward said lower surface; inserting a wire in each of said one or more blind holes; firing said sheet and wire to a temperature sufficient to sinter the sheet material and cause it to form a hermetic compression seal around said wire; and removing sufficient sheet material from said sheet lower surface to expose said wire thus forming a through hole containing said wire, wherein said firing occurs by ramping up to a first temperature at a first heating rate;
then ramping up to a second temperature higher than the first temperature at a second heating rate different from the first heating rate. - View Dependent Claims (19, 20, 21)
-
Specification