Modular insert and jack including bi-sectional lead frames

• US 7,481,678 B2
• Filed: 06/14/2007
• Issued: 01/27/2009
• Est. Priority Date: 06/14/2007
• Status: Active Grant

• Current Assignee: Legrand DPC LLC (Legrand SA)
• Original Assignee: Ortronics Incorporated (Legrand SA)
• Inventors: Aekins, Robert A.
• Primary Examiner(s): Paumen; Gary F.
• Application Number:
  US11/818,478
• Publication Number:
  US 20080311778A1
• Time in Patent Office: 593 Days
• Field of Search: 439/620.11, 439/620.13, 439/620.09, 439/676
• US Class Current: 439/620.11
• CPC Class Codes: H01R 13/6464 by adding capacitive elements
• CPC Class Codes: H01R 13/7033 making use of elastic extensions of the terminals
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: Y10S 439/941 Crosstalk suppression

Abstract

The present disclosure is related to a modular insert and associated jack assembly used in telecommunication connector systems that reduces the adjacent lines electro magnetic interference from an adjacent transmitter for different plug assemblies. The internal contacts/lead frames feature a bi-sectional design. Internal EMI line reduction is allowed only when the bi-sectional contacts are electrically mated by a plug with corresponding contact layout. By isolating the contact sections in the interface system, the coupled signal for EMI balance is optionally utilized in a low cost and manufacturable design.

Claims

1. An insert for use in a communication jack, comprising:

a. an insert housing member,

b. a plurality of lead frames supported at least in part by said insert housing member, wherein at least one of said plurality of lead frames is a bi-sectional structure, said bi-sectional structure including a front end portion and a rear end portion; and

c. a capacitive element in electrical communication with at least the front end portion of said bi-sectional structure.

2. The insert of claim 1, wherein insert member housing includes an upper portion and a lower portion that cooperate to capture and support the plurality of lead frames.

3. The insert of claim 1, wherein the plurality of lead frames includes eight (8) lead frames in a side-by-side orientation at least one end of the insert housing member.

4. The insert of claim 3, wherein the insert housing member is positioned in a jack housing, and wherein the jack housing further includes first and second contact pairs in opposed corners thereof.

5. The insert of claim 4, wherein the eight lead frames define two central pairs, and wherein the first and second contact pairs in the opposed corners of the jack housing correspond to said two central pairs.

6. The insert of claim 1, wherein the plurality of lead frames includes eight lead frames, and wherein each of the four central lead frames defines a bi-sectional structure.

7. The insert of claim 1, wherein the front end portion and the rear end portion are supported in a cantilevered manner.

8. The insert of claim 1, wherein the bi-sectional structure is adapted to move between a “

closed”

state wherein the capacitive element is in electrical communication and energized with a circuit associated with the bi-sectional structure, and an “

open”

state wherein the capacitive element is electrically isolated from the circuit.

9. The insert of claim 1, wherein the capacitive element is in communication with at least two of said plurality of lead frames.

10. The insert of claim 9, wherein the capacitive element includes a pair of spaced capacitive pads or plates.

11. The insert of claim 10, further comprising a dielectric positioned between said spaced capacitive pads or plates.

12. The insert of claim 9, wherein the capacitive element includes interdigitated elements or fingers.

13. The insert of claim 9, wherein the capacitive element includes capacitive traces on a printed circuit board.

14. The insert of claim 13, wherein the capacitive traces include at least one of capacitive pad traces, capacitive plate traces, and capacitive interdigitated traces.

15. The insert of claim 13, wherein the printed circuit board supports the front end portion of the bi-sectional structure in a cantilevered manner.

16. The insert of claim 1, wherein the capacitive element is effective to compensate for noise introduced to the lead frames through connection with a plug.

17. A jack assembly comprising:

a. a jack housing defining a plug-receiving space, and

b. an insert assembly positioned within the jack assembly, the insert assembly including (i) an insert housing member, (ii) a plurality of lead frames supported by said insert housing member, wherein at least one of said plurality of lead frames is a bi-sectional structure, said bi-sectional structure including a front end portion and a rear end portion, and (iii) a capacitive element in electrical communication with at least the front end portion of said bi-sectional structure.

18. The jack assembly of claim 17, wherein the plurality of lead frames includes eight (8) lead frames in a side-by-side orientation exposed to the plug-receiving space.

19. The jack assembly according to claim 18, wherein the jack housing further includes first and second contact pairs in opposed corners thereof.

20. The jack assembly according to claim 19, wherein the eight lead frames define two central pairs, and wherein the first and second contact pairs in the opposed corners of the jack housing correspond to said two central pairs.

21. The jack assembly according to claim 17, wherein the plurality of lead frames includes eight lead frames, and wherein each of the four central lead frames defines a bi-sectional structure.

22. The jack assembly according to claim 17, wherein the front end portion and the rear end portion are supported in a cantilevered manner.

23. The jack assembly according to claim 17, wherein the bi-sectional structure is adapted to move between a “

closed”

state wherein the capacitive element is in electrical communication and energized with a circuit associated with the bi-sectional structure, and an “

open”

state wherein the capacitive element is electrically isolated from the circuit.

24. The jack assembly according to claim 17, wherein the capacitive element is in communication with at least two of said plurality of lead frames.

25. The jack assembly according to claim 24, wherein the capacitive element includes a pair of spaced capacitive pads or plates.

26. The jack assembly according to claim 25, further comprising a dielectric positioned between said spaced capacitive pads or plates.

27. The jack assembly according to claim 24, wherein the capacitive element includes interdigitated elements or fingers.

28. The jack assembly according to claim 24, wherein the capacitive element includes capacitive traces on a printed circuit board.

29. The jack assembly according to claim 28, wherein the capacitive traces include at least one of capacitive pad traces, capacitive plate traces, and capacitive interdigitated traces.

30. The jack assembly according to claim 28, wherein the printed circuit board supports the front end portion of the bi-sectional structure in a cantilevered manner.

31. The jack assembly according to claim 17, wherein the capacitive element is effective to compensate for noise introduced to the lead frames through connection with a plug.