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Injection-molded package for MEMS inertial sensor

  • US 7,482,193 B2
  • Filed: 12/20/2004
  • Issued: 01/27/2009
  • Est. Priority Date: 12/20/2004
  • Status: Expired due to Fees
First Claim
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1. A method of packaging a MEMS device, comprising the steps of:

  • providing a substrate having an inertial sensor, provided therein or thereon;

    providing a cap, having a number of openings formed through the cap;

    attaching the cap to the substrate and sealing the inertial sensor within an interior cavity at least partially formed by the cap and substrate, wherein the cap openings provide a passageway to the interior cavity;

    inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity out through the cap openings to form a reduced pressure or vacuum-filled reference cavity therein;

    injection molding a package about the capped substrate while under a reduced or vacuum pressure within said vacuum chamber; and

    providing a lead frame including one or more conductive leads; and

    attaching the capped substrate to the lead frame and electrically connecting the inertial sensor to the one or more conductive leads,wherein attaching the capped substrate to the lead frame is performed prior to inserting the capped substrate into the vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity.

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