Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems

• US 7,485,346 B2
• Filed: 01/30/2006
• Issued: 02/03/2009
• Est. Priority Date: 02/20/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Bem, Branko, Babiklan, Dikran
• Primary Examiner(s): Bashore; Alain L
• Application Number:
  US11/343,368
• Publication Number:
  US 20060127822A1
• Time in Patent Office: 1,100 Days
• Field of Search: 427/421.1, 427/425, 427/427.2, 118/313, 118/319, 118/321, 118/323, 118/52, 222/386
• US Class Current: 427/421.1
• CPC Class Codes: B05C 5/001 incorporating means for heating or cooling the liquid or other fluent material B05C11/1042 takes precedence
• CPC Class Codes: B05C 5/0208 for applying liquid or other fluent material to separate articles B05C5/0204 takes precedence
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence

Abstract

Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.

Claims

1. A method for dispensing a photoresist solution, comprising:

selecting a coating module within a wafer track system that includes;

a dispense arm to support a gripper for engaging and actuating a fluid syringe;

storing the fluid syringe that contains the photoresist solution within the coating module;

instructing the dispense arm and the gripper to select and removably engage the fluid syringe;

directing the dispense arm with the gripper and the fluid syringe to a predetermined location over a semiconductor wafer;

actuating the fluid syringe to dispense the entire photoresist solution contained therein onto the semiconductor wafer; and

disposing of the fluid syringe.

2. The method of claim 1,

wherein the dispensing the photoresist solution onto the semiconductor wafer is carried out over a substantially center portion the semiconductor wafer as the semiconductor wafer is spinning on a spin chuck.

3. The method of claim 1, further comprising:

returning the dispense arm and the gripper to a standby position within the coating module.